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Signoff ECO
Tempus PI
Timing analysis
Tempus Timing Signoff Solution

SSV 20.2 Base Release Now Available

15 Dec 2020 • 2 minute read

The SSV 20.2 production release is now available for download at Cadence Downloads.  

For information about supported platforms, compatibility with other Cadence tools, and details of key issues resolved in the SSV 20.2 release, see the README.txt file.

At the time of publishing, the link above was functional. If you encounter any links that are now obsolete, visit https://downloads.cadence.com, click the LINUX tab, and select the SSV release name you are interested in to access the related files. 

Here is a list of some of the important updates made to TempusTM Timing Signoff Solution for the 20.2 production release:  

Tempus

  • Tempus Power Integrity Flow
    The Tempus Power Integrity Analysis (Tempus PI) solution provides the capability to run IR analysis that is timing-aware, and timing analysis that is IR-aware. The Tempus PI is a seamless integration of the Tempus static timing analysis (STA) and Voltus power and IR drop technologies.

    For more information, refer to the Tempus User Guide on Cadence Support portal.

  • Infinite Depth Path-Based Analysis (IPBA)
    The Tempus software supports infinite depth path-based analysis (IPBA). This feature runs faster analysis (vs full depth exhaustive PBA (EPBA)) and attains PBA design coverage with no depth limit per endpoint. 

    For more information, refer to Report Enhancements in the Tempus What's New on Cadence Support portal.

  • SmartScope Supports Timing Context Models
    The Tempus SmartScope feature allows you to perform timing analysis with block context models - which is a top-down hierarchical STA technique. The context model feature allows block timing/glitch analysis and closure with realistic constraints instead of pessimistic block budgeted constraints. 

    For more information, refer to Timing Enhancements in the Tempus What's New on Cadence Support portal.

  • Large Number of Active Timing Views Using SmartMMMC
    The Tempus software provides the ability to handle a large number of active timing views using the SmartMMMC feature. This feature is used to enable reduced memory and faster run time when many timing views are enabled during timing or power ECO fixing stage. 

    For more information, refer to the section on SmartMMMC in the Tempus User Guide on Cadence Support portal.

  • New Metal ECO Flow
    A new Metal ECO flow, also called Post-Mask ECO, using the Gate Array filler cells has been introduced. In this flow, the timing closure engine performs the netlist change without touching the base layer mask.


    For more information, refer to "Metal ECO Flow" in the Tempus User Guide on Cadence Support portal.

For more details about the new and enhanced features introduced in this release, see Tempus What's New.

Please send questions and feedback to ssv_rm@cadence.com.

To receive SSV release announcements like this one, and other SSV-related information, directly in your mailbox, type your email ID in the Subscriptions field at the top of the page and click SUBSCRIBE NOW.


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