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Is it possible to check signal at a node inside chip after fibrication?

Analog Design

 Hi .....,

           I wan to check signal strength at a particular node which is connected between two modules inside chip(after fibrication) . Is it possible to check it? ...........,If possible then how to do it ?

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  • I think what he means is to take measurements at points other than those given I/O pads in a fab'd chip. Short answer I am confident is no, although there may be some cost ineffective way to do this that I'm not aware of. This is especially true if you are packaging and not probing. I did wafer probing in my prototype fabs and dropping a needle onto a trace will destroy it and possibly devices or traces around it depending on spacing. Probe pads which were 100um x 100um eventually were damaged after several attempts and a new die had to be used, so trying to probe a wire which is maybe tens or hundreds of nanometers in width is pointless, the tip will just tear through it.

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  • I think what he means is to take measurements at points other than those given I/O pads in a fab'd chip. Short answer I am confident is no, although there may be some cost ineffective way to do this that I'm not aware of. This is especially true if you are packaging and not probing. I did wafer probing in my prototype fabs and dropping a needle onto a trace will destroy it and possibly devices or traces around it depending on spacing. Probe pads which were 100um x 100um eventually were damaged after several attempts and a new die had to be used, so trying to probe a wire which is maybe tens or hundreds of nanometers in width is pointless, the tip will just tear through it.

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