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can someone tell me why a bondpad is a three terminal device?

PeterXia over 13 years ago

Process: IBM CMOS8RF, 0.13 um.

Tool: Cadence 514

In this process, the bondpad symbol has three terminals, I/O, GND!, and SUB!.

Can someone tell me why it is so.

Thanks a lot !!

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Quek over 13 years ago

Hi Peter

The GND! and SUB! terminals are most probably for shielding the bondpad for better performance at high frequencies. You can take a look at the following link. There is a bit of discussion on this.

http://www.scribd.com/doc/97178561/48/Bond-pad-effect

Best regards
Quek
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Quek over 13 years ago

Hi Peter

The GND! and SUB! terminals are most probably for shielding the bondpad for better performance at high frequencies. You can take a look at the following link. There is a bit of discussion on this.

http://www.scribd.com/doc/97178561/48/Bond-pad-effect

Best regards
Quek
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