• Skip to main content
  • Skip to search
  • Skip to footer
Cadence Home
  • This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

  1. Community Forums
  2. Custom IC Design
  3. Bonding Wire in Cadence Virtuoso

Stats

  • Locked Locked
  • Replies 10
  • Subscribers 126
  • Views 13692
  • Members are here 0
This discussion has been locked.
You can no longer post new replies to this discussion. If you have a question you can start a new discussion

Bonding Wire in Cadence Virtuoso

Senan
Senan over 3 years ago

Hello

I am using the Cadence Virtuoso tools version IC6.1.8-64b.500.6, and now trying to make a chip prototype.

I am on the level of bonding the chip I/O pads to the selected package pins. My problem is that I am not able to find the "Wire Bond" tool on my cadence. I read that it can be reached from the "route" tap, but it is not appearing in my case, not sure if Cadence has updated to another tool which I am kindly asking your help to find.

In the simplest form, I tried to connect the wire bonds just like normal layout wiring, however, this type can only give me 45° degree of freedom, while most of wire bonds need to be smaller.

The procedure I am following in the layout package step is

1. creating new layout cell (with a certain name)
2. inserting the top layout chip with pads
3. inserting the selected package (added to cadence from gds stream )

Thank you in advance for your help

  • Cancel
Parents
  • Andrew Beckett
    Andrew Beckett over 3 years ago

    Where did you read that? As far as I know the only tool in Virtuoso for creating wirebonds is part of the Virtuoso RF Solution (and it's on the Module menu). This flow is using data that comes from the Allegro package and SIP tools, not a package that was imported via stream - in general Virtuoso is not a packaging tool, although the Virtuoso RF flow allows you to edit the different technology fabrics together in a common environment which is useful for ensuring correct alignment and understanding electromagnetic problems that might occur due to interactions between structures on the die, the bond wire and the package and board fabrics.

    From what you say you're not talking about Virtuoso RF, hence my request to find out where you read that...

    Andrew

    • Cancel
    • Vote Up +1 Vote Down
    • Cancel
  • Senan
    Senan over 3 years ago in reply to Andrew Beckett

    Hello Andrew,

    Thank you for your reply,

    I was referring to this reference:

    https://support.cadence.com/apex/techpubDocViewerPage?xmlName=wcoms.xml&title=W%20Commands%20--%20Commands:%20W%20-%20wire%20bond%20escape&hash=pgfId-1036118&c_version=17.4-2019&path=wcoms/wcoms17.4-2019/wchap.html#pgfId-1036118

    As I understand also from you there is a different tool for making the wire bonding and advanced packaging, however, we are using the simple DIL package type as seen from the attached image. For this package, a manual connection is possible for me, but as I have explained in my post, I am not able to create a mental connection with angles that are required between the pin and the pad, this might solve my problem.

    • Cancel
    • Vote Up 0 Vote Down
    • Cancel
  • Andrew Beckett
    Andrew Beckett over 3 years ago in reply to Senan

    This is not a Virtuoso manual. It's part of the APD (Allegro Package Designer) documentation, which is the right tool for the job - package design is not part of the Virtuoso flow (with the exception of Virtuoso RF Solution Option).

    Andrew

    • Cancel
    • Vote Up +1 Vote Down
    • Cancel
  • Senan
    Senan over 3 years ago in reply to Andrew Beckett

    Thank you Andrew for clearing it to me, may I ask you please about the Virtuoso RF Solution, how we could include this tool our installed Cadence, or do we need a new fresh Cadence installation.

    Regards

    • Cancel
    • Vote Up 0 Vote Down
    • Cancel
  • Andrew Beckett
    Andrew Beckett over 3 years ago in reply to Senan

    Please contact your account team. It's part of the iCADVM20.1 release, but you need to set particular environment variables and licenses. Search on the support site in the Rapid Adoption Kits for "Virtuoso RF" for some examples (not sure they cover the wire bond creation though - I can't remember - there is an example database, but it may not have been published on the support site).

    Andrew

    • Cancel
    • Vote Up +1 Vote Down
    • Cancel
Reply
  • Andrew Beckett
    Andrew Beckett over 3 years ago in reply to Senan

    Please contact your account team. It's part of the iCADVM20.1 release, but you need to set particular environment variables and licenses. Search on the support site in the Rapid Adoption Kits for "Virtuoso RF" for some examples (not sure they cover the wire bond creation though - I can't remember - there is an example database, but it may not have been published on the support site).

    Andrew

    • Cancel
    • Vote Up +1 Vote Down
    • Cancel
Children
  • Senan
    Senan over 3 years ago in reply to Andrew Beckett

    Thank you, Andrew, that was wonderful, I found plenty of information for the Virtuoso RF from the support center and I will go to read it.

    Meanwhile, I have found a way of how to create a connection with any angle, I should not use create wire, with create > shape > path and then F3 and changing the anle option to any option and it worked with me.

    I hope the following will be my last question :)

    As I am imported the packages as .gds stream by the package house provider, they said it is mandatory to fill the chip details in the table given with the package as you can kindly see from the attached image, but I didn't find a tool in layout environment to add text (except when I make label), or there is a way of adding text, and to which layer should be assigned?

    Thank you in advance

    • Cancel
    • Vote Up 0 Vote Down
    • Cancel
  • Andrew Beckett
    Andrew Beckett over 3 years ago in reply to Senan
    Senan said:
    As I am imported the packages as .gds stream by the package house provider, they said it is mandatory to fill the chip details in the table given with the package as you can kindly see from the attached image, but I didn't find a tool in layout environment to add text (except when I make label), or there is a way of adding text, and to which layer should be assigned?

    Er, isn't that just Create->Label? I'm not sure why you think that "text" is something different from creating a label?

    I've no idea what layer they are expecting this on - perhaps the same layer that is already there for the existing labels? I don't know how I can answer that question - I can't read the mind of the package house provider.

    Andrew

    • Cancel
    • Vote Up +1 Vote Down
    • Cancel
  • Senan
    Senan over 3 years ago in reply to Andrew Beckett

    Dear Andrew,

    You solved my issue, I thought the label is different from TEXT as it is the case in the schematic design, but now you answered me for this.

    Best Regards

    • Cancel
    • Vote Up 0 Vote Down
    • Cancel
  • Andrew Beckett
    Andrew Beckett over 3 years ago in reply to Senan

    Text in schematics are also labels. Some are labels on a particular layer attached to wires for naming nets, and some are just unattached labels on the "text" layer for note information - but they are all labels...

    Anyway, glad your issue is solved.

    Andrew

    • Cancel
    • Vote Up +1 Vote Down
    • Cancel
  • Senan
    Senan over 3 years ago in reply to Andrew Beckett

    thank Andrew you again for your further clarification

    Best Regards

    • Cancel
    • Vote Up 0 Vote Down
    • Cancel

Community Guidelines

The Cadence Design Communities support Cadence users and technologists interacting to exchange ideas, news, technical information, and best practices to solve problems and get the most from Cadence technology. The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information. By accessing, contributing, using or downloading any materials from the site, you agree to be bound by the full Community Guidelines.

© 2025 Cadence Design Systems, Inc. All Rights Reserved.

  • Terms of Use
  • Privacy
  • Cookie Policy
  • US Trademarks
  • Do Not Sell or Share My Personal Information