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Using undesirable Metal Layer when using filler

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    Hello,

I am asking the encountyer tool to use fille in my design using this command;

setFillerMode -corePrefix FILL -core "FILL64 FILL32 FILL16 FILL8 FILL4 FILL2 FILL1"
addFiller
addMetalFill

I am using this command after globaldetail routing.
At the same time I asked the routing tool to use only metal 1 to 4 for routing using :
setmaxroutelayer 4
But when I look at the GDS file generated I see the encounter uses metal 5-6 and 7 for fillers. i was looking at my lef technology file and there the filler only specifies to use metal 1 !!!
so i just wonder how to modify this to make the filler uses metal 1 to 4 only.

Thanks,

Houman



Originally posted in cdnusers.org by houmanh
Parents

  • Hi Houman,

    I'm glad you found the information helpful!

    That's a good point you make about the addMetalFill command order. Via fill is not required for all processes. You'll need to check whether the technology you're working with has a density requirement for vias- many processes do not. If your process does not require via fill, then you would *not* need to run addViaFill prior to running addMetalFill. The command order suggestion is only applicable for technologies that have both metal density and via density requirements. Taking the point further- even if you instruct the tool to do tied metal fill (that connects to gnd/vdd) you would not need to run addViaFill to make those connections. They would be made automatically by addMetalFill.

    Regards,
    Bob


    Originally posted in cdnusers.org by BobD
Reply

  • Hi Houman,

    I'm glad you found the information helpful!

    That's a good point you make about the addMetalFill command order. Via fill is not required for all processes. You'll need to check whether the technology you're working with has a density requirement for vias- many processes do not. If your process does not require via fill, then you would *not* need to run addViaFill prior to running addMetalFill. The command order suggestion is only applicable for technologies that have both metal density and via density requirements. Taking the point further- even if you instruct the tool to do tied metal fill (that connects to gnd/vdd) you would not need to run addViaFill to make those connections. They would be made automatically by addMetalFill.

    Regards,
    Bob


    Originally posted in cdnusers.org by BobD
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