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Placing bond pads for inline IOs

Hope all are doing great.

I have some query regarding the placement of bondpads in encounter.My design is not flip chip type, so the command placeBondPad command didn't worked in it.But some one please tell me, how you place the bondpads in the design.

I have already added the pad into my design using addInst command.But I need to place it at my pins of the IO cells.Please help me for the same.

Anjana over 13 years ago

I understand that this is a very old post, but if you are still active in the community - how did you resolve it ? Did you write a script like a script for placing the IOs to place the bond pads ?
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