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IO Pads & Bond Pads

I am working on a design which has IO Pads and Bond pads and as this is my first time working with bond pads, I am unsure if the placement is alright. I have placed them adjoining each other with their LB metal pins overlapping. I shall attach a picture of it with this post. Is it how the placement should be ?

I placed the bond pads by writing a script like this -

relativeFPlan --place u_padring/u1_bond_gnd TR $chipLeft $chipBottom 0 50 R90

relativeFPlan --relativePlace u_padring/u_bond_gpio6 TR \
u_padring/u1_bond_gnd TL 0 $LeftOffset R90 ... and so on.

Is this the right approach ?

I would much appreciate a feedback.

Regards,

Anjana

KarelH over 13 years ago

Hello Anjana.
The best way, how to verify it is to stream out the gds and check it in some gds viewer as calibredrv.
Regards,
Karel
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Anjana over 13 years ago

Thank you Karel, I suppose that would be the best way to ascertain that there are no errors .
Thanks .
Regards,Anjana
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