multiple bonding points

In APD and SiP, you do not pre-define bonding points on the pads. Rather, you spread the wires per your manufacturing rules using the Route -> Wire Bond -> Tack Point Move command. You can choose to manually move wires a specified distance, move wire ends interactively, or have the tool automatically spread them evenly either parallel or perpendicular to the die edge.

There is, I believe, even a DRC check for wire end to wire end clearance. It's in Constraint Manager, under the Assembly workbook, Wire folder, Wire-to-Wire Online Spacing page. The column name is "Wire End to Wire End".

Regards,
- Tyler 

 Thank you Tyler, I can now move the wire that is there on the die pad, how can I add another wire to the same DP? Thanks again.

Never mind the above question I found out how that was done.Thanks again Tyler.