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multiple bonding points

I have a die pad with multiple bonding wires come out from it. Is there a way to create several bonding points on that die pad so the wires

will be seperated instead of coming out from the center. Please help. Thanks.

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VLSI88 over 12 years ago

Never mind the above question I found out how that was done.Thanks again Tyler.
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VLSI88 over 12 years ago

Never mind the above question I found out how that was done.Thanks again Tyler.
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