Default finger padstack and export .mcm to .brd

Changing the finger padstack in the options tab will change it only for the current operation. If you are trying to change the default itself (Sorry, it was difficult to tell from your description what your actual problem was -- a lack of padstacks or the ability to change the default one used for new fingers), you should change the default finger padstack in the wire bond global settings. This is available from the menu under Route -> Wire Bond -> Settings. In there, change the default finger padstack to whichever pad in your database you want (that is legal for use as a bond finger). This will then be used for your new fingers when created. You can change the defaults for the other options tab fields in this form, too, as well as defining the wire profile curvatures. 

Note that when you are moving fingers, the options tab will always default to the finger's existing padstack. If you want to change a bunch of fingers at a time to a different padstack, select all the fingers and use the change characteristics command from the RMB menu. 

With regards to your second question, it sounds to me as though you are trying to do a wire bond chip on board style of design, with the fingers directly on the PCB substrate and the wire bonds connecting from the bare die to the fingers. If that is the case, you really should talk with the Cadence customer support and product marketing teams to understand what they advise in terms of a chip on board design flow. I'm sure there are much better flows available than the one you are describing of trying to use a module to copy and paste things from the MCM into a BRD drawing. You'll lose the 3D profile definitions with your methodology, among other things. Going with whatever process Cadence officially recommends will almost certainly be much easier, cleaner, and faster than your current setup. I cannot say exactly what their flow is in this matter, though, as I don't do chip on board designs. 

Regards,
- Tyler

Changing the finger padstack in the options tab will change it only for the current operation. If you are trying to change the default itself (Sorry, it was difficult to tell from your description what your actual problem was -- a lack of padstacks or the ability to change the default one used for new fingers), you should change the default finger padstack in the wire bond global settings. This is available from the menu under Route -> Wire Bond -> Settings. In there, change the default finger padstack to whichever pad in your database you want (that is legal for use as a bond finger). This will then be used for your new fingers when created. You can change the defaults for the other options tab fields in this form, too, as well as defining the wire profile curvatures. 

Note that when you are moving fingers, the options tab will always default to the finger's existing padstack. If you want to change a bunch of fingers at a time to a different padstack, select all the fingers and use the change characteristics command from the RMB menu. 

With regards to your second question, it sounds to me as though you are trying to do a wire bond chip on board style of design, with the fingers directly on the PCB substrate and the wire bonds connecting from the bare die to the fingers. If that is the case, you really should talk with the Cadence customer support and product marketing teams to understand what they advise in terms of a chip on board design flow. I'm sure there are much better flows available than the one you are describing of trying to use a module to copy and paste things from the MCM into a BRD drawing. You'll lose the 3D profile definitions with your methodology, among other things. Going with whatever process Cadence officially recommends will almost certainly be much easier, cleaner, and faster than your current setup. I cannot say exactly what their flow is in this matter, though, as I don't do chip on board designs. 

Regards,
- Tyler