Default finger padstack and export .mcm to .brd

You can add as many bond finger padstacks to the design as you like. To be available for use as a bond finger, it must be a single-layer pad on either the top or bottom surface layer (unless you have enabled cavity bonding, in which case single layer pads on those cavity layers are also permitted). You can bring these padstacks in from your library if they are there, you can make new ones based on existing finger pads already in your design using the padstack editor tool and saving them to a different name before updating into your design. While adding wirebonds, there is an "Add" button next to the padstack pull-down field in the options tab which will allow you to define a based oblong or rectangle finger on the fly during your bonding, as well. 

With records to your other question, I do not really know what you are trying to do. If you are creating a module for reuse between one design and another, then the cross-sections need to match in order for things to work. If you are trying to place an instance of this package into a PCB under design, I think you should be using the File -> Export -> Board Level Component command, which creates the necessary library symbol, front end files, etc. for use in your PCB layout.

Hope that helps,
- Tyler

 Hi Tyler,

Thanks for your answers.

For default padstack, changing padstack in pull-down field in the option tab is my current way. But for each time of moving/adjust, the pad stack will be restored as the default. I don't want to browse to my desire padstack manually like that. I found out my way that i edited the default padstack to my expert size then saved the same name to replace the old one, it works well :).

As my particular design, not really IC package that mean we don't have BGA package ball so that File/Export/Board Level component doesn't work ("E- (SPMHIS-120): No BGA (class = IO) component found in design. Nothing to export."). I just want to arrange the padstack/finger around the die pad, then reuse the finger coordinates, die and bond wire path into my .brd. do i have any other options ?

Changing the finger padstack in the options tab will change it only for the current operation. If you are trying to change the default itself (Sorry, it was difficult to tell from your description what your actual problem was -- a lack of padstacks or the ability to change the default one used for new fingers), you should change the default finger padstack in the wire bond global settings. This is available from the menu under Route -> Wire Bond -> Settings. In there, change the default finger padstack to whichever pad in your database you want (that is legal for use as a bond finger). This will then be used for your new fingers when created. You can change the defaults for the other options tab fields in this form, too, as well as defining the wire profile curvatures. 

Note that when you are moving fingers, the options tab will always default to the finger's existing padstack. If you want to change a bunch of fingers at a time to a different padstack, select all the fingers and use the change characteristics command from the RMB menu. 

With regards to your second question, it sounds to me as though you are trying to do a wire bond chip on board style of design, with the fingers directly on the PCB substrate and the wire bonds connecting from the bare die to the fingers. If that is the case, you really should talk with the Cadence customer support and product marketing teams to understand what they advise in terms of a chip on board design flow. I'm sure there are much better flows available than the one you are describing of trying to use a module to copy and paste things from the MCM into a BRD drawing. You'll lose the 3D profile definitions with your methodology, among other things. Going with whatever process Cadence officially recommends will almost certainly be much easier, cleaner, and faster than your current setup. I cannot say exactly what their flow is in this matter, though, as I don't do chip on board designs. 

Regards,
- Tyler

 Hi Tyler,

That's so weird.  Route -> Wire Bond -> Settings does not allow me to browse to other customized padstack, instead, there are ony 2 default padstack. I also noted that "Global Wire Bond Constraints" does not affect to the design, for instance, i changed "Wire physical properties Diameter" to 1 mil and checked "Feasibilitty mode" but nothing work. :(.

I will raise my concerns to Cadence application enigneer for their adivices.

Thank you,