Scripts or commands to create the package stackup

you can always import and export the cross section technology file from the cross secton editor.

you can simply add one conductor between the 2 solder masks.

you need to make sure that the padstacks connecting the upper and lower packages have the conductor you have just added as well.

Hi All,

Is it possible to combine 2 sip packages through some utility instead of manual work ? 

For example I have a 4 layer OSAT database and I need to add a different interposer database to this original 4 layer database ?

Also can you please share any documents for doing silicon interposer design in SIP/APD ?

regards

you can simply import the different interposer database into the osat database file.

it is only one manual operation.

you need to make sure that the the layer names are the same and the symbol does not have any same name.

if the padstacks have the same name, you need to make sure that all the pad diameters are also identical.

thanks for the reply but BY import do you mean FILE -> IMPORT -> . tcfx file ?

no, it is not tcfx.

i do not have apd in front of me as i work at home today.

but i think, if i am correct, file --> export --> sub-drawing on the different interposer file.

after selecting all the objcts on the all layers, then select the sub-drawing's origin.

then open the osat database file and import the sub-drawing.

no, it is not tcfx.

i do not have apd in front of me as i work at home today.

but i think, if i am correct, file --> export --> sub-drawing on the different interposer file.

after selecting all the objcts on the all layers, then select the sub-drawing's origin.

then open the osat database file and import the sub-drawing.

thanks I will try this out.

I am also facing an issue that while routing I am unable to add the newly created vias. The via .pad files are in the same folder where the old vias and .sip file lies. But not sure when adding the via seems the option to select any layer is disabled.

try to see that the padstack is correct by tools -> padstack -> modify desgin padstack.

then click the padstack to verify all the pad diameters and layer names are coorect on the padstack.

if this does not work, create a new padstack to see the padstack on the padstack list by tools -> padstack -> modify desgin padstack..

thanks for the reply. The news vias that i created are visible in the via list inside CM but not when I am trying to add them  during routing.

Also seems there has been some issue as I am getting the below message when opening the design "

(SPMHA1-161): Cannot open the design because of database problems. Run the dbdoctor command on the design and try to open again.

did u assign the padstack that can be used from which layer to which layer?

if not, u need to assign it on the constraint manager.

thanks for the reply. I see them in the CM in the via list,

do i need to define the TO & FROM anywhere else also ?