Does anyone know how to connect two pins of a die to the same net so they are considered a short inside of APD?

what i usually do is to add one more layer (a conductive layer and a dielectric layer as a pair) on top of the existing design. on the added layer with clines and vias, u can connect the two pins

Hi masamasa, 

I have done this in the past but it won't work for this situation. I need connections on the top and bottom of the die to be considered a short. The bottom side is attached to an embedded substrate layer and the top side is in a diestack. I thought a d2d via might work but it won't allow this to an embedded layer, only a surface layer. I'm still stuck.

r u talking about an embedded die like an embedded bridge?

Yes, this is an embedded die. You could consider it to be similar to an embedded bridge.

Yes, this is an embedded die. You could consider it to be similar to an embedded bridge.

what i see on our customers' design with embedded bridge is that they treat the embedded bridges as part of their package (interposer). they do not treat the embedded bridges as components (symbols). if u r talking about embedded dies, that may not be possible as embedded dies can be more complex than embedded bridges.

Thanks for the suggestion. I will look into whether this would be possible in my scenario. It will likely depend on whether an interposer can have both top and bottom side connections.

Hi masamasa,

Unfortunately when attempting to use an interposer, it doesn't permit pins (bondpad vias) on the bottom side of the interposer. 

This type of thing really should be possible. This is frustrating.