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Connecting to GND and VCC planes while routing

AKSHAYA

Hi

    I have created a board with four layers. The inner layers are ground and VCC and the VCC and GND nets of the circuit made electrically connected to these planes by changing the net name. How we can connect the top and botton VCC and GND tracks to these planes. Is it possible using via, burried via or blind via. Whether we can put vias where ever connections are required or we have to connect using only one two vias. If vis is to be used what should be  the specifications of thermal pad and anti pad?. I am using only SMD pads.

Hope somebody may be able to help me 

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  • Hi

    Thanks for you reply. My clarification is that  when we put via to connectt the track on the outer layers to shapes in the inner layers will it automatically put blind vias from the respective outer layers to the respective inner layers or we have to select blind vias  depending upon the layers we are connecting?. If we put blind vias for each pin connection is the cost will escalate because of increase in number of blind vias. Is there any difference in manufacturing cost depending on the number of through via, burried via and blind via? Hoping a valuable help

    Regards
    Akshaya
Reply
  • Hi

    Thanks for you reply. My clarification is that  when we put via to connectt the track on the outer layers to shapes in the inner layers will it automatically put blind vias from the respective outer layers to the respective inner layers or we have to select blind vias  depending upon the layers we are connecting?. If we put blind vias for each pin connection is the cost will escalate because of increase in number of blind vias. Is there any difference in manufacturing cost depending on the number of through via, burried via and blind via? Hoping a valuable help

    Regards
    Akshaya
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