Best way to do blind/buried RF vias?

I have some RF nets routed on internal layers.  The layer transitions typically involve a number of micro-vias (i.e. 1-2, 2-3, etc.) and sometimes buried vias.  In either case, I often need to clear out antipads on the layers above and below the via capture pads to get rid of extra capacitance.  For example, if I'm going from L2->L3 and I have ground plane on L1 and L4 I'd need anti-pads on L1 and L4.

The way I've been doing this is to create, say, a b/b via in the Pad Editor from L2->L3 and then manually adding voids on the PCB on L1 and L4.  This is tedious and error-prone, and it's a pain if I have to move that via later.  I can create the via in the Pad Editor with the anti-pads (but no Regular Pad) defined on L1 and L4, but then the hole for that via is generated in the L1-4 drill file, not in the L2-3 drill file as it should be.

Can anyone think of a better way to do this?