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Vias under package

So i have this footrpint where the manufacturer suggests thermal vias under the package as shown in this picture....

I used Ultra librarian to create the footprint for ORCAD. The problem is that it turned each via into a pin though .....

I would like to know if this is the way it is done in ALLEGRO or if there is a better way to place vias under a package footprint?

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Dale Peterson over 5 years ago

Just add mechanical thru pins that look like your vias to your part in the library.

Cheers
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Dale Peterson over 5 years ago

Just add mechanical thru pins that look like your vias to your part in the library.

Cheers
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Lock2002 over 5 years ago in reply to Dale Peterson

mechanical pins will be electrically isolated. I would assume these need to be connected to a return plane
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