Vias under package

I thought heat was best conducted through the vias into the (larger/continuous) ground planes.  FLIR analysis of test boards has me suspecting better heat conductivity on surface pours under the device..   I always create SMD footprints and add stitching vias as we don't always use parts at full power, so a fixed number of vias doesn't pay off for us.  Vias are always part of the board object.  

Just add mechanical thru pins that look like your vias to your part in the library.

Cheers

Ultra Librarian is okay for basic parts, but this is far from basic. It looks like it might work electrically but it's not a good design. I would create it manually. Add the vias manually as well. 

mechanical pins will be electrically isolated. I would assume these need to be connected to a return plane

I got the part file from TI , they recommended using ultra librarian to export to CADENCE.

I just used ultra librarian because this part is on the complex side. Basic parts are done easily in ORCAD.

I agree with you guys on adding the vias manually . It gives one better control.