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Vias under package

nutron

So i have this footrpint where the manufacturer suggests thermal vias under the package as shown in this picture....

I used Ultra librarian to create the footprint for ORCAD. The problem is that it turned each via into a pin though .....

I would like to know if this is the way it is done in ALLEGRO or if there is a better way to place vias under a package footprint?

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  • I got the part file from TI , they recommended using ultra librarian to export to CADENCE.

    I just used ultra librarian because this part is on the complex side. Basic parts are done easily in ORCAD.

    I agree with you guys on adding the vias manually . It gives one better control.

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  • I got the part file from TI , they recommended using ultra librarian to export to CADENCE.

    I just used ultra librarian because this part is on the complex side. Basic parts are done easily in ORCAD.

    I agree with you guys on adding the vias manually . It gives one better control.

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