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Test Point to Component Distance Report

obwise

Hey guys

I was working on a test point to component csv parser file to see if I could find test points that were too close to each other according some clearance rules and the scope expanded beyond what i'm capable of right now on the software side of things.  While still working on this project for my own sake, I wanted to know if there was already a feature of OrCAD PCB Designer where I could see a report of test points that are too close to components or that would at least display distances between components, if they're on the top or bottom.  I would like the edge to edge distances between the test points and components.

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  • Regarding the Valor NPI 'testpoint' analysis functionality, the list below is from 2009, I don't know if they added anything since then:

    “Testpoint to Testpoint (Spacing)”
    “Testpoint to Toeprint (Spacing)” 
    “Testpoint to Capped Via (Spacing)” 
    “Testpoint to Uncapped Via (Spacing)” 
    “Testpoint to Exposed Copper (Spacing)”
    “Testpoint to Exposed Copper (Primary) (Spacing)”
    “Testpoint to Exposed Copper (Secondary) (Spacing)” 
    “Testpoint to Unexposed Copper (Spacing)”
    “Testpoint Density (Spacing)”
    “Testpoint Density Under Component (Spacing)”
    “Testpoint to NPTH (Drill)” 
    “Testpoint to THMT Toeprint (Drill)”
    “Testpoint to Tooling Hole (Drill)” 
    “Testpoint to Rout (Rout)”
    “Testpoint to Conveyed Edge (Rout)” 
    “Testpoint to Non-Conveyed Edge (Rout)”
    “Testpoint Under Component (Component)” 
    “Testpoint to Component (Component)” 
    “Testpoint to Component Angle (Component)” 
    “Testpoint to SM (Solder Mask)”
    “Testpoint Missing Solderpaste (Solderpaste)”
    “Capped Testpoint Vias (Via Capping)”
    “Via Capped On Both Sides (Via Capping)” 
    “Uncapped Non-Testpoint Vias (Via Capping)”
    “Testpoints Outside Keepin Area (Keepin/Keepout)” 
    “Testpoints Within Keepout Area (Keepin/Keepout)”

    Then there is the 'DFT Testpoint Allocation Analysis' functionality, which adds the following:

    Nets without Potential Testpoints (Testpoint Allocation)
    Nets with One Potential Testpoint (Testpoint Allocation)
    Nets with Multiple Potential Testpoints (Testpoint Allocation)
    Potential Testpoints (Toeprint) (Testpoint Allocation)
    Potential Testpoints (Via) (Testpoint Allocation)
    Potential Testpoints (Other) (Testpoint Allocation)
    Potential Testpoint to Potential Testpoint (Distance) (Testpoint Allocation)
    Potential Testpoint to Potential Testpoint (Clearance) (Testpoint Allocation)
    Potential Testpoint to Exposed Copper (Testpoint Allocation)
    Potential Testpoint to NPTH (Testpoint Allocation)
    Potential Testpoint to Edge (Testpoint Allocation)
    Potential Testpoint under Component (Testpoint Allocation)
    Potential Testpoint to Component (Distance) (Testpoint Allocation)
    Potential Testpoint to Component (Clearance) (Testpoint Allocation)
    Probes to Component (Testpoint Allocation)
    Potential Testpoint Contact Diameter (Testpoint Allocation)
    Potential TP Large Pad (Testpoint Allocation)
    Potential Testpoint to Silk Screen (Testpoint Allocation)
    Potential Testpoint within Keepout Area (Testpoint Allocation)
    Potential Testpoint Not on Grid (Testpoint Allocation)

Reply

  • Regarding the Valor NPI 'testpoint' analysis functionality, the list below is from 2009, I don't know if they added anything since then:

    “Testpoint to Testpoint (Spacing)”
    “Testpoint to Toeprint (Spacing)” 
    “Testpoint to Capped Via (Spacing)” 
    “Testpoint to Uncapped Via (Spacing)” 
    “Testpoint to Exposed Copper (Spacing)”
    “Testpoint to Exposed Copper (Primary) (Spacing)”
    “Testpoint to Exposed Copper (Secondary) (Spacing)” 
    “Testpoint to Unexposed Copper (Spacing)”
    “Testpoint Density (Spacing)”
    “Testpoint Density Under Component (Spacing)”
    “Testpoint to NPTH (Drill)” 
    “Testpoint to THMT Toeprint (Drill)”
    “Testpoint to Tooling Hole (Drill)” 
    “Testpoint to Rout (Rout)”
    “Testpoint to Conveyed Edge (Rout)” 
    “Testpoint to Non-Conveyed Edge (Rout)”
    “Testpoint Under Component (Component)” 
    “Testpoint to Component (Component)” 
    “Testpoint to Component Angle (Component)” 
    “Testpoint to SM (Solder Mask)”
    “Testpoint Missing Solderpaste (Solderpaste)”
    “Capped Testpoint Vias (Via Capping)”
    “Via Capped On Both Sides (Via Capping)” 
    “Uncapped Non-Testpoint Vias (Via Capping)”
    “Testpoints Outside Keepin Area (Keepin/Keepout)” 
    “Testpoints Within Keepout Area (Keepin/Keepout)”

    Then there is the 'DFT Testpoint Allocation Analysis' functionality, which adds the following:

    Nets without Potential Testpoints (Testpoint Allocation)
    Nets with One Potential Testpoint (Testpoint Allocation)
    Nets with Multiple Potential Testpoints (Testpoint Allocation)
    Potential Testpoints (Toeprint) (Testpoint Allocation)
    Potential Testpoints (Via) (Testpoint Allocation)
    Potential Testpoints (Other) (Testpoint Allocation)
    Potential Testpoint to Potential Testpoint (Distance) (Testpoint Allocation)
    Potential Testpoint to Potential Testpoint (Clearance) (Testpoint Allocation)
    Potential Testpoint to Exposed Copper (Testpoint Allocation)
    Potential Testpoint to NPTH (Testpoint Allocation)
    Potential Testpoint to Edge (Testpoint Allocation)
    Potential Testpoint under Component (Testpoint Allocation)
    Potential Testpoint to Component (Distance) (Testpoint Allocation)
    Potential Testpoint to Component (Clearance) (Testpoint Allocation)
    Probes to Component (Testpoint Allocation)
    Potential Testpoint Contact Diameter (Testpoint Allocation)
    Potential TP Large Pad (Testpoint Allocation)
    Potential Testpoint to Silk Screen (Testpoint Allocation)
    Potential Testpoint within Keepout Area (Testpoint Allocation)
    Potential Testpoint Not on Grid (Testpoint Allocation)

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