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Vias and footprint

LOR75

Hello,

I have to design a QFN64 footprint with a thermal pad at the center of the component; obviously this pad must be connected to the ground plane of the bottom layer by using vias.

What's the best way to put vias?

1 - Put vias in the pad during "pad  designer session" so when i place the pin in the foorprint the vias are already inserted in the footprint;

2 - Place a filled square area for the central pad (without vias) and then place vias  during the routing of the board over the filled square

what do you usally do? Are these solution identical for the final result?

Best regards.

Parents

  • I have done hundreds of BTC component designs for a large company, we always use the pad designer to embed the vias in the ePad.  BTW, the biggest issue with BTC design is the PM (Paste Mask), if you don't have a copy of the IPC7093 Standard (2020) you should.  It covers the PM design quit well. 

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  • I have done hundreds of BTC component designs for a large company, we always use the pad designer to embed the vias in the ePad.  BTW, the biggest issue with BTC design is the PM (Paste Mask), if you don't have a copy of the IPC7093 Standard (2020) you should.  It covers the PM design quit well. 

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