Stats

Replies 18
Subscribers 162
Views 7142
Members are here 0

Display Your Know How: Footprints

Which footprint option is best, A or B?

Let’s say your PI specialist advises that this part requires maximum power transfer according to the component rating… Which library footprint do you choose?

Simply answer by letter or include any reason to support your answer. Alternatives and opinions are welcome!

jc teyssier 11 months ago

Depend on your assembly house: each one use different rule.

We use "A" since assembly house may vary. Each one adapt solder paste film to their own process.

Some use "A", some use "B, some use "B" BUT not square but round, some....
Cancel
Vote Up +1 Vote Down

Sign in to reply

Cancel
John T 11 months ago in reply to Wild

Yes this is what I meant. These are good guidelines - thank you!
Cancel
Vote Up 0 Vote Down

Sign in to reply

Cancel
John T 11 months ago in reply to jc teyssier

Thanks JC - I imagine this depends if you use thermal vias within the pad also.

I am interested to know if anyone has experience with outgassing or the effects the layout has on solder voiding.
Cancel
Vote Up 0 Vote Down

Sign in to reply

Cancel

Cadence Guidelines

Community Guidelines

The Cadence Design Communities support Cadence users and technologists interacting to exchange ideas, news, technical information, and best practices to solve problems and get the most from Cadence technology. The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information. By accessing, contributing, using or downloading any materials from the site, you agree to be bound by the full Community Guidelines.