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Test Your Know How: PCB Separation

PCBTech

Organize these three separation technologies into order: 

1. SPEED

2. COST 

3. STRESS 

A = Scoring, B = Tab Routing/Milling, C = Lazer Cutting

Which is the fastest speed, the highest cost, and the highest stress on the PCB and surrounding components?

If you are concerned about product lifespan in your designs, do you consider these factors? Simply answer your order in the comments below. Any further input or questions from your experiences are also very welcome!   

  • in reply to eDave

    Interesting thanks eDave! I guess for lower volume production this could be a good option. Or just high value products that require the precision! This sparked a thought: Wondering if different paste types can be deposited by the same machine during the assembly phase? Finer paste types have become necessary for soldering the newest range of package types such as leadless packages. But some of the high power components in the assembly could do with the heavier paste. It might be an option. 

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