• Skip to main content
  • Skip to search
  • Skip to footer
Cadence Home
  • This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

  1. Community Forums
  2. Allegro X PCB Editor
  3. What is Preventing Designers from Improving Decoupling?

Stats

  • Replies 0
  • Subscribers 164
  • Views 25
  • Members are here 0
More Content

What is Preventing Designers from Improving Decoupling?

John T
John T 5 hours ago

We see many designs every day but most do not follow the performance recommendations when it comes to power and ground via placement for decoupling capacitors.

Why ?

What is preventing you from pushing your designs to perform at their electrical best:
1. Is it costs?
2. Is it due to manufacturing or fabrication?
3. Is it speed for design completion or DRC management?

The highest level recommendation is to place grounding and power vias inside the capacitor pads

Let’s share some industry experience if anyone has overcome these hurdles or have suggestions or reasons for the approach.

Appreciating any thoughts or comments below.

  • Sign in to reply
  • Cancel
Cadence Guidelines

Community Guidelines

The Cadence Design Communities support Cadence users and technologists interacting to exchange ideas, news, technical information, and best practices to solve problems and get the most from Cadence technology. The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information. By accessing, contributing, using or downloading any materials from the site, you agree to be bound by the full Community Guidelines.

© 2026 Cadence Design Systems, Inc. All Rights Reserved.

  • Terms of Use
  • Privacy
  • Cookie Policy
  • US Trademarks
  • Do Not Sell or Share My Personal Information