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0.5mm pitch BGA fan out

Hi, I am using 0.5mm pitch BGA in my design ,which is having land diameter 0.35mm . I want to use via(PTH) in pad technology , the fan out concept shown in figure (using 6mil drill on the 0.4mm pad ) .I have few concern reg via in pad technology 1)whether it is able to fabricate Via (6mil drill ) for 1.6mm PCB , any aspect ratio problem? 2)how much reliable this technology during assembling If anybody done used this concept pls suggest Regards, Girish Kumar

Nagaraj Shanmu over 16 years ago

Girish,

the aspect ration for 1.6mm with 6 mil drill comes to 10.5 which is acceptable by most of Manufacturers. But you need to have to confirm from your manufacturer before you decide.
We use via-in-pad for our design manufactured and assembled without any issues.

See this doc from merix http://www.merix.com/files/merix_bulletin_HDI.pdf

~Nagaraj.
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girish over 16 years ago

Thanks Nagaraj for your immediate response .
could you pls. suggest the land dia & antipad dia for the via this help me more
Regards,
Girish Kumar
Bangalore
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girish over 16 years ago

Is it possible to suppress unconnected via pads while routing itself ?
Regards,
Girish kumar
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Nagaraj Shanmu over 16 years ago

In Allegro 16.x you can use menu setup-->unused pads suppression option
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Nagaraj Shanmu over 16 years ago

use drill+10mil (via pad)+10mil (antipad)
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