Shape parameters - thermal/anti - pos layer

Unless I'm misunderstanding your question here are several things that you want to pay attention to when you use thermal relief.  You can set these globally or independently per shape.

Globally...

 Setup>Design Parameters, Shapes Tab, Edit global dynamic shape parameters..., Thermal relief connects Tab

1] Orthogonal or Diagonal contact. 2] Minimun (maybe 2) and Maximum (maybe 4) connects.

3] Use a fixed thermal width, 4] Use thermal width oversize

Clearances Tab 

5] You can have the dynamic shape follow either the Thermal/anti that was defined when the padstack was made or follow your DRCs in Constraint Manager. 6] You can oversize the clearance.  

Independently...

Shape>Select Shape or Void, Select the shape and RMB (right mouse button), Select Parameters... Change settings as desired.

Maybe I was a little too vague with my request.......I was assuming that all of the above was already taken into consideration. What happened is that I had a 25 pin registration coupon having the same pitch between pins but varying anti pad sizes throughout the array. When doing the anti pad to anti pad calculations I was expecting a certain size web, when what was happening is that it became oversized totally blowing the web away. So I guess what I'm really asking is when using the thermal/anti pad what constraints (aka shape to pad/via) would affect this to make it oversized? I would think that if you choose thermal/anti pad that's what you'd get with on other constraints affecting it.

The thermal / anti options are normally only used for negative shapes. It's probably best if you set the shape parameters to DRC for a positive dynamic shape, then use Constraint Manager to define your pad to options (like shape). This way you can set a different rule for each net so you get the array clearance required.