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How to create Micro-Via stacks?

CCR77

Hello,

        I am currently working on a 10 layer ELIC (Every Layer Interconnect).  It will use micro-via stacks that span the layers of the board. Is there a way to create micro-via stacks?  For example ground is on Layer 4 and I have to drop many vias from 1 to 4.  My current method is extremely time consuming.

Add Connect

Select Active Layer

Select Alternate Layer

Add Via

Change Alternate Layer to the following Layer

 Add Via

And so on and so forth...

I am looking for a solution that would allow me to select the active layer and the destination layer and the micro-via stack to be created automatically. I am familiar with editing pad stacks, however I not quite sure how to do this correctly.  There has to be a way to do this, however I have been unable to locate adequate documentation to make this happen. Any and all help would be greatly appreciated.

Thanks,

Clint

  • Ejlersen

    Hi

    I would take a look at working layer model which is what you're looking for, it was introduced in 16.2 and has been improved since - it really is an excellent way to work with blind/buried vias including microvias. 

    /blogs/pcb/archive/2008/11/12/what-s-good-about-hdi-via-structures-check-out-the-spb16-2-release-and-see.aspx

    Ole

  • CCR77

    Hi Ole,

            Thanks for the pointer.  Once I ordered my via span correctly in the constraint manager it works great! Huge time saver!

    Thanks again,

    Clint

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