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pspice smoke analysis

Ninja17
Ninja17 over 9 years ago

hi have built a citcuit in pspice a regulator circuit with pass transistors for more current i am using igbts but when i run a smoke analysis its tells me the max power dissipation is is to high for the igbt's but its only 24 watts when the max power disipation is 200 watts according to the datasheet but in the rated column is states it is rated at 3.669 watts so i went into the model editor and tried a few values in the power dissipation column and max juction temperature but that rated value would not change when i altered the parameters of the igbt so i don't know whats going on please could someone help i am desperate thanks

thanks for your help

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  • Alok Tripathi
    Alok Tripathi over 9 years ago

    I tend to agree with Oldmouldy about the possible cause of derated power IGBT. One of the key feature of PSpice Smoke Analsis is it's built-in deration. It warns user about potential failure under current operating conditions.

    For semiconductor devices, Smoke derates the rated power as per junction temperature. Image shown below variation of rated power as per junction temperature.

    You may want to modify the "RCA" property on pass transistor. Value of this property should be as per heat sink thermal impedance. This property will simulate an associated "heat sink" with this device, thus bringing junction temperature down and making available higher rated power for device under operating condition. Hope this clarifies.
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  • Alok Tripathi
    Alok Tripathi over 9 years ago

    I tend to agree with Oldmouldy about the possible cause of derated power IGBT. One of the key feature of PSpice Smoke Analsis is it's built-in deration. It warns user about potential failure under current operating conditions.

    For semiconductor devices, Smoke derates the rated power as per junction temperature. Image shown below variation of rated power as per junction temperature.

    You may want to modify the "RCA" property on pass transistor. Value of this property should be as per heat sink thermal impedance. This property will simulate an associated "heat sink" with this device, thus bringing junction temperature down and making available higher rated power for device under operating condition. Hope this clarifies.
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