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Creating a footprint with surface mount pads on top and bottom layers

Ginomai

I have run into a snag with creating an edge connector footprint that has pads on both the top and bottom layers of the board.  I have defined an SMD padstack with only a BEGIN LAYER in the Pad Editor and placed the pins for the top layer.  However, I cannot figure out how to place pins that should be on the bottom.  I am using the PCB Editor and I'm trying to do this while creating a package symbol.  Thanks for your help!

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  • Fran D

    I hate dusting off an old thread, but I am having the same problem with 17.2 in creating a footprint for an edge card. I have followed each and every of the suggestions, in this thread and others, but every time I try to place a pad on the opposite side of the board, I get an SMD-SMD spacing violation. Why would this be relevant? The two pads are on opposite sides of the board! I can't find anything in the constraints that would suggest there would be a top-bottom SMD spacing violation. What gives?

  • redwire
    in reply to Fran D

    Do you mind attaching your symbol to this thread?  Or send a PM so it can be looked at closer.  No reason you should be getting that error so something is setup wrong.

  • Fran D
    in reply to redwire

    I think I found it. I defined the top set of pads as the BEGIN LAYER and the bottom set of pads as the END LAYER. No more DRC errors, but I'm used to seeing the pin labels reversed on the opposite side of the board. I am assuming that is the correct approach?

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  • Fran D
    in reply to redwire

    I think I found it. I defined the top set of pads as the BEGIN LAYER and the bottom set of pads as the END LAYER. No more DRC errors, but I'm used to seeing the pin labels reversed on the opposite side of the board. I am assuming that is the correct approach?

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