I am looking into chamfering the edge of PCB for Board edge connectors. I have performed fillet command earlier but new to chamfering.
Below is the description :
As seen above, the PCB edge are chamfered in thickness as well as at the corners.
Using OrCAD PCB hotfix S023.
Our fabrication data we generate does not convey chamfering, AFAIK. The board outline is either intelligent from ODB or 2581 or computed from a gerber layer (RouteMaster software?)
For PCI/PCI-E test boards, never justified the cost-add for the 2-10 times the board is inserted into a connector over the lifespan of the board.
In case I'm wrong, you still want to state this as needed in your fabrication notes to make sure it isn't forgotten. This will be an extra process step after mask/silkscreen.
I think the chamfered corners (0.64x 45deg) can be implemented using the chamfer command as they lie on the Board Outline property.
But not sure, if the same could be achieved in case of '0.5x 45deg along entire edge' as mentioned above as this chamfering is in PCBs cross section direction. So, believe best is to mention this chamfering in the fabrication notes.
But would appreciate if i could manage it myself rather than depending upon the manufacturer.