• Skip to main content
  • Skip to search
  • Skip to footer
Cadence Home
  • This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

  1. Community Forums
  2. Sigrity
  3. How to get the via backdrill layers through TCL script.

Stats

  • State Not Answered
  • Replies 2
  • Subscribers 21
  • Views 60
  • Members are here 0
More Content

How to get the via backdrill layers through TCL script.

ABIKRISHNA
ABIKRISHNA 7 hours ago

Hello Team,

                 I am currently working on automating a task in PowerSI 2021.1 using a TCL script. My goal is to remove the backdrill from vias based on a given net name. We are able to retrieve the vias associated with the net, but we are unable to get the details of each via connecting layers using script.

Could you please advise on how to identify the backdrill start and end layers of via through TCL.

  • Cancel
  • Sign in to reply
Parents
  • CadAP
    0 CadAP 5 hours ago

    ABIKRISHNA 

    Please try the below command it provide via details:

    The result format is:
    {viaName netName|UnnamedNets upperLayerName lowerLayerName upperNodeName lowerNodeName padStackName}.

    set lAllVia [sigrity::query -Via]

    foreach via $lAllVia {

    #puts $via

    sigrity::querydetails via -name $via

    }

    • Cancel
    • Vote Up 0 Vote Down
    • Sign in to reply
    • Verify Answer
    • Cancel
  • ABIKRISHNA
    0 ABIKRISHNA 1 hour ago in reply to CadAP

    Hi CadAP,

                Thanks for your suggestion. We already used this query to get the layer details of the vias. However, we still need a method to identify only the via backdrill layers.

    We would like to explain our scenario clearly:

    For example, consider a through-via in a 32-layer PCB. If the via is used only up to Layer 7 from the Top side, then the portion from Layer 8 to Layer 32 becomes a stub. This section requires backdrilling.

    We are looking for a TCL-based method or any PowerSI option that can provide the start layer and end layer of the via stub for each via instance.
    Although we can extract general via layer information through the existing queries, it does not help us identify the exact backdrill layers in different topologies. The stub portion is not directly distinguishable from the current output.

    • Cancel
    • Vote Up 0 Vote Down
    • Sign in to reply
    • Verify Answer
    • Cancel
Reply
  • ABIKRISHNA
    0 ABIKRISHNA 1 hour ago in reply to CadAP

    Hi CadAP,

                Thanks for your suggestion. We already used this query to get the layer details of the vias. However, we still need a method to identify only the via backdrill layers.

    We would like to explain our scenario clearly:

    For example, consider a through-via in a 32-layer PCB. If the via is used only up to Layer 7 from the Top side, then the portion from Layer 8 to Layer 32 becomes a stub. This section requires backdrilling.

    We are looking for a TCL-based method or any PowerSI option that can provide the start layer and end layer of the via stub for each via instance.
    Although we can extract general via layer information through the existing queries, it does not help us identify the exact backdrill layers in different topologies. The stub portion is not directly distinguishable from the current output.

    • Cancel
    • Vote Up 0 Vote Down
    • Sign in to reply
    • Verify Answer
    • Cancel
Children
No Data
Cadence Guidelines

Community Guidelines

The Cadence Design Communities support Cadence users and technologists interacting to exchange ideas, news, technical information, and best practices to solve problems and get the most from Cadence technology. The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information. By accessing, contributing, using or downloading any materials from the site, you agree to be bound by the full Community Guidelines.

© 2025 Cadence Design Systems, Inc. All Rights Reserved.

  • Terms of Use
  • Privacy
  • Cookie Policy
  • US Trademarks
  • Do Not Sell or Share My Personal Information