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  • Discussion

    Where I Find "Orcad Footprint Libraries" Book(manual)? Locked

    1219 views
    2 replies
    Latest over 16 years ago
    by codemon
  • Discussion

    stitching via along cline Locked

    18298 views
    6 replies
    Latest over 16 years ago
    by brodesu
  • Discussion

    Transaction tracing in simvision Locked

    15802 views
    3 replies
    Latest over 16 years ago
    by vmotel
  • Discussion

    using two connectors for one footprint/symbol Locked

    1806 views
    3 replies
    Latest over 16 years ago
    by Wild
  • Discussion

    Model file for schottky in analogLib in Cadence Locked

    15835 views
    1 reply
    Latest over 16 years ago
    by Jim McMahon
  • Discussion

    ARM libraries, IBM PDK, Cadence PVS questions... Locked

    15128 views
    2 replies
    Latest over 16 years ago
    by tkhan
  • Discussion

    LEC Issue with falling edge clock gater cells Locked

    14407 views
    1 reply
    Latest over 16 years ago
    by croy
  • Discussion

    How to send points from layout window to draw a multipart path Locked

    15860 views
    5 replies
    Latest over 16 years ago
    by AmitBiswas
  • Discussion

    pin-floating check in Concept HDL Locked

    12903 views
    0 replies
    Started over 16 years ago
    by peter zhu
  • Discussion

    half harmonic frequency in PSS analysis Locked

    14318 views
    1 reply
    Latest over 16 years ago
    by Andrew Beckett
  • Discussion

    ConceptHDL inter-page connection Locked

    14035 views
    1 reply
    Latest over 16 years ago
    by peter zhu
  • Discussion

    irun (ncsim) without waveform Locked

    18788 views
    8 replies
    Latest over 16 years ago
    by Games people
  • Discussion

    Adding via in Allegro 16.2 Locked

    24861 views
    6 replies
    Latest over 16 years ago
    by satya12
  • Discussion

    discrepancies between electrical package and physical footprint Locked

    13362 views
    1 reply
    Latest over 16 years ago
    by John Davies
  • Discussion

    BGA component spacing for high volume manufacturing (cell phone boards). Locked

    13312 views
    1 reply
    Latest over 16 years ago
    by Chalford
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