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How to place IO pins on internal wires and bumps in Innovus?

Hi All,

I'm currently using Innovus to implement a full chip design that has flip chip bumps and has IO pad rings on the periphery.

I would like to place IO pins of signals and power/ground directly on the bumps but struggling to find a good method to do so.

I can't seem to find anything in the userguide to help me with this. I tried editPin but it will only allow pins to be on the side edges, which is not what I want.

I tried commands to move pins but it also won't let me move pins inside the die area, only letting me move pins to the edges.

Is there a good way to do this?

MikeLW over 8 years ago

editPin does seem to be mostly geared towards placing pins along the edges, but I think you can do what you want with -assign x y. Have you tried that?
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fieldy over 8 years ago

Yes, I tried that but all it would do is place the the pin on the outer edges of the chip, ignoring one of x or y coordinates. This seems like a very fundamental procedure that should be possible to do, so I'm hoping there's a simple way to do this which I haven't found yet.
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Kari over 8 years ago

It's been a while since I've done this, but I don't think you need to use editPin at all. Once you use assignSigToBump to assign a bump to a signal, then the little yellow triangle should appear on top of the bump.
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mishrak over 8 years ago

You can place IO pins inside block by using editPin -side inside option.
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