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Featured

Linley: Chiplets for Infrastructure Silicon

At the recent Linley Fall Processor Conference, R. "Suds" Sudhakar of Cisco gave…

Paul McLellan
• 5 min read
featured , linley processor conference , Cisco , 3DIC , datacenter

TSMC OIP: FINFLEX, Analog Migration, mmWave, and Awards

Last week it was "OIP," TSMC's Open Innovation Platform Ecosystem Forum. My day consisted…

Paul McLellan
• 5 min read
featured , mmwave , 3Dblox , TSMC , analog
Breakfast Bytes
Latest blogs

November Update: Power, TOP500, the Kaufman Dinner, Fred Brooks, and an Award

Today is the last day in November, amazingly, and since I was on vacation last Friday…

• 5 min read
Apple , asml , top500 , power , datacenter , IEDM , satellite

Sunday Brunch Video for 20th November 2022

https://youtu.be/gLQbSlICCaE Made in Munich Englischergarten (camera Carey) Monday…

• less than a min read
sunday brunch

Old Programming Languages

This is the last day before a break. Tomorrow I fly to Germany for CadenceLIVE Europe…

• 11 min read
offtopic

Software 2.0

I recently came across the idea of "software 2.0". I was watching a Lex Fridman interview…

• 5 min read
software 2.0 , neural networks , andrej karpathy , AI

Passage: Wafer-Scale Programmable Photonic Communication

One of the most intriguing chips presented at HOT CHIPS earlier this summer was Lightmatter…

• 2 min read
lightmatter , silicon photonics , photonics , passage

Tensilica for Automotive Radar

At the recent Linley Fall Processor Conference, Cadence's David Bell presented Tailored…

• 2 min read
linley processor conference , ConnX , radar , Tensilica , Breakfast Bytes

Linley: Enabling Heterogeneous Integration of Chiplets Through Advanced Packaging…

At the recent Linley Fall Processor Conference, the first day wrapped up with a presentation…

• 3 min read
packaging , linley processor conference , AMD , 3dhi , 3DIC , xilinx

Linley: Chiplets for Infrastructure Silicon

At the recent Linley Fall Processor Conference, R. "Suds" Sudhakar of Cisco gave…

• 5 min read
featured , linley processor conference , Cisco , 3DIC , datacenter

Agricultural Equipment for Kids

If you have been reading Breakfast Bytes for a long time, then you will know that…

• 6 min read
agricultural electronics

Linley Keynote Fall 2022

Last week was the Linley Fall Processor Conference. That still seems to be the name…

• 6 min read
linley processor conference , Linley , techinsights , AI

EDPS: Transitioning from 5G to 6G

At the recent EDPS, the keynote on the second day was by Mallik Tatipamula. He is…

• 4 min read
5G , Ericsson , EDPS , mobile , 6G

TSMC OIP: 3DFabric Alliance and 3Dblox

The press meeting at the recent OIP was all about 3DFabric and 3Dblox. If you don…

• 3 min read
OIP , 3dfabric alliance , 3Dblox , TSMC , 3dfabric

EDPS: When Chips Become 3D Systems and the Challenges of 3DHI

One of the presentations at the recent EDPS was by Cadence's John Park. Unlike most…

• 6 min read
packaging , 3dhi , 3DIC , EDPS

TSMC OIP: FINFLEX, Analog Migration, mmWave, and Awards

Last week it was "OIP," TSMC's Open Innovation Platform Ecosystem Forum. My day consisted…

• 5 min read
featured , mmwave , 3Dblox , TSMC , analog , TSMC OIP , 3dfabric , analog migration
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