The Year That Was: Cadence IC Packaging and SiP Blogs in 2020

And so, here we are at the end of the year. I do hope that our weekly IC posts livened up 2020's groundhog days full of online meetings, washing up, and frantic searches for an Icelandic crime series you haven't yet watched!

As we take stock of the year that's gone by and plan for the new one, here are a few popular posts that we chose for you from this year's IC Packaging and SiP blog series:

• Five Steps to IC-Driven Package Design
• Mysteries Revealed - Why Is Flip-Chip Chip-Down the Default Library Die Orientation?
• Four Reasons to Avoid Multi-Layer Flip-Chip Pin Padstacks
• Establishing Connectivity Between Die and BGA
• Make Acute Angles a Sharp Problem of the Past
• The Choice Between Static and Dynamic Shapes
• A New Option in Bond Finger Solder Mask Openings
• Don’t Get Stranded on Islands, Delete Them!
• The Different Types of Mirrors

We hope that our blog posts were helpful and facilitated quicker task decisions. If you have any suggestions or comments, we'd love to hear from you.

See you all in 2021. Happy Holidays and we wish you the best as you ponder the mechanics of an online New Year's Eve party!