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Featured

Richard Goering, 1952-2023

I have some sad news to report. Richard Goering passed away last month at the age…

Paul McLellan
• 3 min read
featured , Richard Goering , EETimes

DATE 2023 in Antwerp Preview

Design and Test Europe (DATE) is coming up in April. It will be in person and it…

Paul McLellan
• 4 min read
DATE , featured , design and test europe , date 2023 , antwerp

The Chiplet Summit

Last week it was the Chiplet Design Summit in San Jose. Actually, the organizers…

Paul McLellan
• 8 min read
featured , chiplets , AMD , 3dhi , 3DIC
Breakfast Bytes

Latest blogs

Sunday Brunch Video for 20th November 2022

https://youtu.be/gLQbSlICCaE Made in Munich Englischergarten (camera Carey) Monday…

Paul McLellan
• less than a min read
sunday brunch

Old Programming Languages

This is the last day before a break. Tomorrow I fly to Germany for CadenceLIVE Europe…

Paul McLellan
• 11 min read
offtopic

Software 2.0

I recently came across the idea of "software 2.0". I was watching a Lex Fridman…

Paul McLellan
• 5 min read
software 2.0 , neural networks , andrej karpathy , AI

Passage: Wafer-Scale Programmable Photonic Communication

One of the most intriguing chips presented at HOT CHIPS earlier this summer was…

Paul McLellan
• 2 min read
lightmatter , silicon photonics , photonics , passage

Tensilica for Automotive Radar

At the recent Linley Fall Processor Conference, Cadence's David Bell presented Tailored…

Paul McLellan
• 2 min read
linley processor conference , ConnX , radar , Tensilica , Breakfast Bytes

Linley: Enabling Heterogeneous Integration of Chiplets Through Advanced Packaging…

At the recent Linley Fall Processor Conference, the first day wrapped up with a…

Paul McLellan
• 3 min read
packaging , linley processor conference , AMD , 3dhi , 3DIC , xilinx

Linley: Chiplets for Infrastructure Silicon

At the recent Linley Fall Processor Conference, R. "Suds" Sudhakar of Cisco gave…

Paul McLellan
• 5 min read
featured , linley processor conference , Cisco , 3DIC , datacenter

Agricultural Equipment for Kids

If you have been reading Breakfast Bytes for a long time, then you will know that…

Paul McLellan
• 6 min read
agricultural electronics

Linley Keynote Fall 2022

Last week was the Linley Fall Processor Conference. That still seems to be the name…

Paul McLellan
• 6 min read
linley processor conference , Linley , techinsights , AI

EDPS: Transitioning from 5G to 6G

At the recent EDPS, the keynote on the second day was by Mallik Tatipamula. He is…

Paul McLellan
• 4 min read
5G , Ericsson , EDPS , mobile , 6G

TSMC OIP: 3DFabric Alliance and 3Dblox

The press meeting at the recent OIP was all about 3DFabric and 3Dblox. If you don…

Paul McLellan
• 3 min read
OIP , 3dfabric alliance , 3Dblox , TSMC , 3dfabric

EDPS: When Chips Become 3D Systems and the Challenges of 3DHI

One of the presentations at the recent EDPS was by Cadence's John Park. Unlike most…

Paul McLellan
• 6 min read
packaging , 3dhi , 3DIC , EDPS

TSMC OIP: FINFLEX, Analog Migration, mmWave, and Awards

Last week it was "OIP," TSMC's Open Innovation Platform Ecosystem Forum. My day…

Paul McLellan
• 5 min read
featured , mmwave , 3Dblox , TSMC , analog , TSMC OIP , 3dfabric , analog migration

October Update: AWS, Knuth, CHIPS

The last Friday of the month is my day for an update post, including updates to…

Paul McLellan
• 2 min read
knuth , update , aws , chip war

PACMAN and Using Jasper for Security Verification

At the recent Jasper User Group meeting, there were a couple of presentations on…

Paul McLellan
• 5 min read
Jasper User Group , JUG , formal , Jasper , Formal verification

TSMC OIP: N3E/N4P, 3DFabric, Analog Migration

Today, it ia TSMC's OIP, the Open Innovation Platform Ecosystem Forum. I will write…

Paul McLellan
• 4 min read
OIP , RF , mmwave , n3e , TSMC , n4p , n16

Jasper User Group 2022: Ziyad's SOTU

This year's Jasper User Group meeting took place last week. As usual, the meeting…

Paul McLellan
• 3 min read
Jasper User Group , featured , JUG , formal , jjasper , Formal verification

IEDM and RISC-V Summit 2022 Previews

There are two big events coming up in the first couple of weeks of December. IEDM…

Paul McLellan
• 5 min read
risc-v , risc-v summit , IEDM

Cadence, McLaren, and the United States (Austin) Grand Prix

As you probably know, Cadence has a technology partnership with McLaren racing.…

Paul McLellan
• 5 min read
CFD , F1 , mclaren , formula 1

Latinx Heritage Month

Last week, Cadence held a Mercado Fiesta on the campus to celebrate Latinx Heritage…

Paul McLellan
• 3 min read
latinx , latinx heritage month , Hispanic

USB-C – The Least Standard Standard Ever

In a post in our verification blog , Neelabh Singh told us that USB4 Version 2.0…

Paul McLellan
• 3 min read
usb 4.0 , USB , USB-C

HOT CHIPS: Arm's Morello

HOT CHIPS was back in the summer, and I covered it in two overview posts (and some…

Paul McLellan
• 5 min read
morello , hot chips , ARM , cheri , capability

CadenceLIVE Boston: State-of-the-Art Heterogeneous Integrated Packaging (SHIP)

Congress and the military love to come up with cute acronyms for programs, and so…

Paul McLellan
• 3 min read
RF , SiP , ship , ship-rf , 3dhi

Samsung Foundry Roadmap 2022

Recenty, it was the Samsung Foundry Forum (SFF). In fact, there was a pre-event…

Paul McLellan
• 4 min read
Samsung , samsung foundry , samsung foundry forum , sff , safe

2022 Kaufman Award Honors Giovanni De Micheli

This year's Kaufman Award honors Giovanni De Micheli, usually known as Nanni. Of…

Paul McLellan
• 5 min read
Kaufman Award , CEDA , IEEE , kaufman hall of fame , esd alliance

TSMC OIP Preview 2022

I have pointed out before that you really only get two opportunities a year to get…

Paul McLellan
• 2 min read
OIP , TSMC

Cadence Certus Closure Solution: Automated Full-Chip Optimization

Today, we announced the Cadence Certus Closure Solution, the first-of-its-kind…

Paul McLellan
• 2 min read
featured , Tempus , tempus eco , STA , static timing , certus

3D Heterogeneous Integration (3DHI)

Shakespeare (in Romeo and Juliet) wrote: What's in a name? That which we call a…

Paul McLellan
• 4 min read
system-in-package , SiP , featured , chiplet , 3dhi , system-on-chip , 3DIC , SoC , 2.5D IC , heterogeneous integration
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