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Latest Blog Posts

  • Verification: System Verification Scoreboard: Its Role and Partnership with Verification IPs

    DimitryP
    DimitryP

    As discussed in the last installment of the blog, a robust system level scoreboard is essential for functional verification and performance validation of modern SoCs.

    A properly architected system scoreboard should work in conjunction with interface Verification IPs (VIPs) and share verification responsibilities. It should monitor all ports on an SoC’s interconnect, deploying clever algorithms to track transactions as…

    • 29 Apr 2022
  • Breakfast Bytes: April Update: USB-C, Great Place to Work, Intel Fab Tour, DALL-E

    Paul McLellan
    Paul McLellan
    It's the last Friday in April already, so time for one of my monthly updates where I group small pieces that don't justify an entire blog post on their own. USB-C One of the very first posts I wrote when we started Breakfast Bytes was One Conne...
    • 29 Apr 2022
  • Analog/Custom Design: Spectre Tech Tips: Using the Spectre Strobe Feature

    Stefan Wuensche
    Stefan Wuensche
    From time to time, we observe Spectre customers using the maxstep feature for applications that can be better addressed with the Spectre strobe feature. Therefore, in this blog, we focus on explaining the usage of the Spectre strobe feature.
    • 28 Apr 2022
  • Analog/Custom Design: Knowledge Booster Training Bytes — Registrations Open: Enhancing Layout Productivity with Virtuoso Layout Pro Training

    Dishika Majumdar
    Dishika Majumdar
    We are going to host a webinar on Virtuoso Layout Pro Training in the upcoming month. Check out this blog to know all the details.
    • 28 Apr 2022
  • Computational Fluid Dynamics: Introducing Cadence Fidelity CFD Software

    John Chawner
    John Chawner
    On 19 Apr 2022 we announced Fidelity CFD. As you can imagine, it has dominated my thinking for the past year. To explain Fidelity, here's my conversation with one of the many voices in my head. What is Fidelity? fi·del·i·ty,...
    • 28 Apr 2022
  • Breakfast Bytes: Syntiant Wins MLPerf TinyML Benchmark (with Help from Tensilica HiFi)

    Paul McLellan
    Paul McLellan
    Earlier this month, MLCommons announced the latest round of results for inference. Just to be clear, there were no results for training announced, I guess that will be later in the year. However, Linley Gwenapp covered some aspects of training (based...
    • 28 Apr 2022
  • Computational Fluid Dynamics Helps Marine Life Communicate

    Computational Fluid Dynamics: Computational Fluid Dynamics Helps Marine Life Communicate

    Veena Parthan
    Veena Parthan
    CFD simulations can help control noise emitted by cavitation-infected ship propellers through design optimization techniques to preserve marine life and maintain the underwater ecological balance.
    • 27 Apr 2022
  • Breakfast Bytes: Linley: AI Moving to the Edge

    Paul McLellan
    Paul McLellan
    Last week was the Linley Spring Processor Conference. One change since last year is that the Linley Group, who runs the conferences was acquired in October by Canada-based TechInsights. As it said in the press release announcing the acquisition: &qu...
    • 27 Apr 2022
  • System, PCB, & Package Design : What's New in Clarity 3D Solver: Advancing In-Design EM Analysis

    Sherry Hess
    Sherry Hess
    Increase both performance and capacity for chip, package, and PCB EM analysis with the latest release of Clarity 3D EM solver technology.
    • 27 Apr 2022
  • System, PCB, & Package Design : Silicon Chips: EM Simulation for Passive Circuit Analysis & Model Development

    Sherry Hess
    Sherry Hess
    Modern electrical system design for 5G wireless systems and connected devices for automotive, radar, and semiconductor systems is constantly being pushed to operate at higher frequencies and shifting left the need for EM analysis.
    • 27 Apr 2022
  • System, PCB, & Package Design : 3D-IC: System-Level Electrical and Thermal Challenges

    Sherry Hess
    Sherry Hess
    3D-ICs (the latest technology for fitting more functionality onto a smaller chip) stack silicon wafers or dies on multiple layers and interconnects them vertically with the aim of providing better performance at reduced power. Sounds great, but o...
    • 27 Apr 2022
  • System, PCB, & Package Design : All Systems Go! Find and Fix Thermal PCB Problems Sooner Than Later

    Sherry Hess
    Sherry Hess
    Electrothermal co-simulation—understanding the implications (intended or otherwise) of thermal interactions on electrical performance for high-speed (or high-frequency) PCB designs is now essential.
    • 26 Apr 2022
  • RF Engineering: RF/Microwave System Design Trends

    Sherry Hess
    Sherry Hess
    David Vye of Cadence and Dave Maliniak of Microwaves & RF magazine discuss the Cadence focus on providing the software solutions engineers need to design today’s complex, multi-technology systems.
    • 26 Apr 2022
  • RF Engineering: In-Design EM Analysis for Microwave/RF Design and Verification Workflows

    Sherry Hess
    Sherry Hess
    3D finite element method (FEM) and 3D planar method of moments (MoM) have become a standard design practice for ensuring the accuracy of the overall network simulation.
    • 26 Apr 2022
  • System, PCB, & Package Design : All Systems Go! Ensuring Power Integrity—Explore, Design, and Verify

    Sherry Hess
    Sherry Hess
    When designing an electronic system, ensuring power integrity (PI) is all about making sure that the power you are putting into the system reaches the downstream components in an efficient, sufficient, and stable manner.
    • 26 Apr 2022
  • System, PCB, & Package Design : All Systems Go! - Bridging the Gap Between Design and Analysis

    Sherry Hess
    Sherry Hess
    Electronic designs are increasing in capacity, complexity, and performance.  Of course, but with this push for "Moore" comes ever-increasing pressure to get new products to market as quickly as possible.
    • 26 Apr 2022
  • System, PCB, & Package Design : High-Tech Everything

    Sherry Hess
    Sherry Hess
    Is there any industry left in today’s automated world that does not embrace some aspect of “high tech?” The wireless revolution has made even my garage door a smart (aka high-tech) device..
    • 26 Apr 2022
  • Breakfast Bytes: Asianometry

    Paul McLellan
    Paul McLellan
    If you like to take the semiconductor and EDA industries in video form, then one of my favorite YouTube channels is Asianometry. I contacted Jon V who creates the videos to find out a bit more about him beyond the fact that he lives in Taiwan. For so...
    • 26 Apr 2022
  • Academic Network: Tensilica Education Kit Available Now

    Anton Klotz
    Anton Klotz
    After the big success of the VLSI Fundamental: A Practical Approach Education Kit, the Cadence Academic Network is announcing the availability of the Tensilica Education Kit. The Tensilica Education Kit consists of five modules, which contain videos,...
    • 26 Apr 2022
  • Simulating S-CO2 Power Cycles with Fidelity Pointwise

    Computational Fluid Dynamics: Simulating S-CO2 Power Cycles with Fidelity Pointwise

    Veena Parthan
    Veena Parthan
    Flow transitions in the S-CO2 Brayton cycle can be easily modeled with high resolution and minimum grid points using Fidelity CFD meshing.
    • 25 Apr 2022
  • Breakfast Bytes: DesignCon: Google on AI for Non-AI People

    Paul McLellan
    Paul McLellan
    At the recent DesignCon, one of the keynotes was given by Google's Laurence Moroney, titled The Realities of AI & Machine Learning: Cut through the Hype and Move to Production. Laurence wrote the book AI and Machine Learning for Coders. Both...
    • 25 Apr 2022
  • Breakfast Bytes: Earth Day: What Will It Take to Get to Carbon Neutrality by 2050?

    Paul McLellan
    Paul McLellan
    It's Earth Day today. So let's take a look at what it would take to make everyone's Earth Day wishes come true—carbon neutrality, sometimes called Net Zero, by 2050. As it happens, I'm not especially worried about carbon dioxide. As I...
    • 22 Apr 2022
  • Verification: AMBA Distributed Translation Interface (DTI) for Arm System MMU

    Yeshavanth BN
    Yeshavanth BN

    In ARM MMU-based systems, DTI protocol defines a standard way to communicate with Translation Control Unit (TCU). DTI protocol is a point-to-point protocol with each channel defining a link. The communication with TCU will be from two different components, and DTI protocol defines both.

    • Communication between Translation Buffer Unit (TBU) and TCU (DTI-TBU Protocol)
    • Communication between PCIe Root Complex and TCU (DTI…
    • 21 Apr 2022
  • カスタムIC/ミックスシグナル: Virtuosity: カスタムIC設計フロー/手法 – 回路図のキャプチャと回路シミュレーション

    Custom IC Japan
    Custom IC Japan
    カスタム/ミックスドシグナル設計における現在の課題は、高速でシリコン精度の高い手法を持つことです。このブログ・シリーズでは、カスタムICの設計フローと手法の段階についてご紹介します。この手法は、設計プロセスを通じてスピードとシリコン精度を最大化することで、これらのIC設計の作成における予測可能性という主要な課題に直接対処します。また、この手法は、アナログ、カスタム・デジタル、RFの主要な設計領域をカバーし、デジタル・スタンダードセル・ブロックとの統合をサポートします。 設計フローの段階 下図は、...
    • 21 Apr 2022
  • Breakfast Bytes: DesignCon: Bespoke Silicon

    Paul McLellan
    Paul McLellan
    Something I've been writing about for literally years is the trend toward system companies designing their own silicon. It started in the mobile industry. Today, all the leading smartphone vendors design their own application processors and,...
    • 21 Apr 2022
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