Thermal Analysis Blogs

Melika Roshandell talks with David Malinak in a Microwaves & RF QuickChat video about the thermal challenges in today’s complex electronic designs and how the Celsius solver uniquely addresses them.

Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These requirements make scaling traditional, flat, 2D-ICs very challenging.  With the recent introduction of 3D-ICs, successful thermal management is even further exacerbated yet Celsius Thermal Solver is uniquely positioned to address.

3D-ICs (the latest technology for fitting more functionality onto a smaller chip) stack silicon wafers or dies on multiple layers and interconnects them vertically with the aim of providing better performance at reduced power. Sounds great, but o...

Electrothermal co-simulation—understanding the implications (intended or otherwise) of thermal interactions on electrical performance for high-speed (or high-frequency) PCB designs is now essential.