Thermal Analysis Blogs

Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These requirements make scaling traditional, flat, 2D-ICs very challenging.  With the recent introduction of 3D-ICs, successful thermal management is even further exacerbated yet Celsius Thermal Solver is uniquely positioned to address.

3D-ICs (the latest technology for fitting more functionality onto a smaller chip) stack silicon wafers or dies on multiple layers and interconnects them vertically with the aim of providing better performance at reduced power. Sounds great, but o...

Electrothermal co-simulation—understanding the implications (intended or otherwise) of thermal interactions on electrical performance for high-speed (or high-frequency) PCB designs is now essential.