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Thermal Analysis
  • Sherry Hess
    Successful Thermal Management of 3D-ICs: Accurate, Fast, Efficient and Scalable with Celsius
    By Sherry Hess | 24 May 2022
    Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These requirements make scaling traditional, flat, 2D-ICs very challenging.  With the recent introduction of 3D-ICs, successful thermal management is even further exacerbated yet Celsius Thermal Solver is uniquely positioned to address.
    0 Comments
    Tags:
    3D-IC | in-design analysis | Electro-thermal cosimulation | Thermal Integrity
  • Sherry Hess
    3D-IC: System-Level Electrical and Thermal Challenges
    By Sherry Hess | 27 Apr 2022
    3D-ICs (the latest technology for fitting more functionality onto a smaller chip) stack silicon wafers or dies on multiple layers and interconnects them vertically with the aim of providing better performance at reduced power. Sounds great, but o...
    0 Comments
    Tags:
    3DIC | in-design analysis | Thermal Integrity
  • Sherry Hess
    All Systems Go! Find and Fix Thermal PCB Problems Sooner Than Later
    By Sherry Hess | 26 Apr 2022
    Electrothermal co-simulation—understanding the implications (intended or otherwise) of thermal interactions on electrical performance for high-speed (or high-frequency) PCB designs is now essential.
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