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Latest Blog Posts

  • System, PCB, & Package Design : What's Good About DEHDL’s Constraints Comparison? The Secret's in the 16.6 Release!

    Jerry GenPart
    Jerry GenPart

    The Allegro 16.6 Design Entry HDL release provides designers a mechanism to compare two databases for constraint differences. The databases that can be compared are of the following types:
    • Schematics (.cpm)
    • Layout design (.brd, .sip, .mcm)
    • Constraints Manager Database (.dcf, .tcf)

    The Constraint Comparison Utility can be used for comparing two different revisions/versions of the schematic or board databases…

    • 16 Apr 2013
  • Analog/Custom Design: Virtuosity: 10 Things I Learned in March by Browsing Cadence Online Support

    stacyw
    stacyw

    Topics in March include advanced analysis in ADE GXL, taking advantage of lots of features for doing statistical analysis in ADE XL, defining bindkeys in ADE L (yes, you can do that!), plus a variety of useful details in the areas of routing and advanced custom layout.

    Enjoy!

    Application Notes

    1. Design Tuning with Analog Design Environment GXL: Interactive and Automated Flows

    Walks through a detailed example using several…

    • 11 Apr 2013
  • System, PCB, & Package Design : Corral Your Selections with New Lasso and Path Modes in 16.6 APD and SiP

    Jeff Gallagher
    Jeff Gallagher
    The level of ease and efficiency you experience in selecting the items needed for modifying in your substrate can mean the difference between a great design experience and an exercise in frustration and futility. With the 16.6 release, Cadence IC P...
    • 11 Apr 2013
  • System, PCB, & Package Design : What's Good About Allegro PCB Editor Generic Cross-Section Files? See for Yourself in 16.6!

    Jerry GenPart
    Jerry GenPart

    Beginning with the Allegro PCB Editor 16.6 release, you are provided a methodology to export a technology (.tcf) or constraints (.dcf) file which is a generic cross-section. A generic-cross-section file (GCSF) captures constraints for specific layer types. Currently, a GCSF supports four types of layers: TOP, INTERNAL (internal signal), PLANE, and BOTTOM.

    Importing a GCSF will not update the design’s cross-section, but…

    • 9 Apr 2013
  • Verification: Develop for Debugability – Part 1

    teamspecman
    teamspecman
    Debugging is the most time-critical activity of any verification engineer. Finding a bug is very often a combination of having a good hunch, experience, and the quality of testbench code that you need to analyze. Since having a good hunch and experience is something everyone needs to acquire for themselves, I am going to focus on potential code optimizations that help reduce debug time.
     
    Encapsulate your Aspects

    As in any…

    • 8 Apr 2013
  • System, PCB, & Package Design : What's Good About RF PCB and Autoplace? 16.6 Has Many New Enhancements!

    Jerry GenPart
    Jerry GenPart

    The 16.6 Allegro RF PCB application has many new enhancements.

    I’ll cover a few over the next several weeks. Here are some major autoplace related enhancements:

    • Grouping in Design Entry HDL (DEHDL)
    • Allegro PCB Editor Enhancements

    Read on for more details …

    Autoplace is a very important step for RF layout after the schematic is transferred to PCB layout. The system will automatically create groups based on connectivity…

    • 3 Apr 2013
  • Analog/Custom Design: Unleashing Mixed-Signal Tech on Tours (ToTs) in North America

    Sathish Bala
    Sathish Bala

    At CDNLive-Silicon Valley this year, we had an excellent mixed-signal track for two days. Cadence customers including IBM, Texas Instruments, Maxim and Freescale shared their mixed-signal methodologies and tricks with the Cadence design community. The key challenges that our mixed-signal customers face are in SoC level verification and seamless analog/digital implementation. Cadence has been addressing these challenges for…

    • 29 Mar 2013
  • Digital Design: Five-Minute Tutorial: Set Flip-Chip Bumps as Voltage Sources in EPS/EDI Rail Analysis

    Kari
    Kari

    When running power and rail analysis for a flip chip, we used to have to spend some time creating the voltage sources. It wasn't too terrible; usually we would output the bumps into a Cadence Encounter Digital Implementation (EDI) .io file, then use a perl script to filter out the pwr/gnd bumps and create the voltage source file format. The script would need a bit of editing from project to project, but nothing too complicated…

    • 26 Mar 2013
  • Verification: Incisive Debug Analyzer is a Finalist for EETimes and EDN ACE Software Product of the Year

    Karnane
    Karnane

    Great news.... Incisive Debug Analyzer (IDA) is one of five finalists for the EETimes/EDN Annual Creativity in Electronics (ACE) Awards in the Software Product of the Year category. In addition to IDA, Lip-Bu Tan and Cadence are also finalists for ACE Executive of the Year and Company of the Year, respectively.

    Check out the Press Release.

    The awards program honors the people and companies behind the technologies and products…

    • 25 Mar 2013
  • System, PCB, & Package Design : What's Good About PCB SI and Vias? 16.6 Has Many New Enhancements!

    Jerry GenPart
    Jerry GenPart

    In the Allegro PCB SI 16.6 release, vias in SigXp have been enhanced to make it more efficient for design use. In addition, Allegro PCB Editor padstacks will be used to build the models.

    Read on for more details …


    Adding Vias


    Adding a via is easier and faster than before. You no longer have to go through the Via Model Generator to create a model nor are you required to search the list of existing models that fit the…

    • 25 Mar 2013
  • Analog/Custom Design: SKILL for the Skilled: Part 7, Many Ways to Sum a List

    Team SKILL
    Team SKILL

    In this episode of SKILL for the Skilled I'll introduce a feature of the let primitive that Scheme programmers will find familiar, but other readers may have never seen before. The feature is called named let, and I'll show you how to use it to sum the numbers in a given list.

    Named LET

    There is a feature of let available in SKILL++ which is not available in traditional SKILL, called named let. Here is an example…
    • 25 Mar 2013
  • System, PCB, & Package Design : Reduce Flip-Chip Design Time with Cadence Advanced Package Router (APR) for 16.6 APD and SiP Layout

    Jeff Gallagher
    Jeff Gallagher
    Perhaps the most time-consuming aspect to designing the package substrate for a large, high pin count flip-chip comes in the form of package routing. Escaping from underneath the flip-chip die itself, routing through multiple substrate layers, and fi...
    • 21 Mar 2013
  • System, PCB, & Package Design : Customer Support Recommended – Regulation Loop Design Using Allegro AMS Simulator (PSpice)

    Naveen
    Naveen

    Feedback regulation loops are widely used by power electronic designers. It is one of the most important and sensitive parts of a power supply circuit. An incorrect feedback loop design may cause oscillations in the circuit, and also increase the output voltage droops. In order to achieve a stable and tight regulation in the output, it is important to have a correct feedback loop.

    To test a feedback loop, generally engineers…

    • 20 Mar 2013
  • System, PCB, & Package Design : What's Good About Allegro Package Designer (APD) Bond Wire "Text In?" You’ll Need the 16.6 Release to See!

    Jerry GenPart
    Jerry GenPart

    Cadence IC Packaging tools today provide a spreadsheet-based import mechanism for die and BGA (standard) components, as well as for importing of netlist updates. In certain design scenarios, particularly for leadframe package designs, it is also desirable to be able to import a similarly formatted file to define the bond wire connections in the design. In this way, when an updated component is brought into the design from…

    • 19 Mar 2013
  • Analog/Custom Design: Virtuosity: 10 Things I Learned in February By Browsing Cadence Online Support

    stacyw
    stacyw

    February was a big month for RAKs (Rapid Adoption Kits)!  If you haven't checked out the listings under Resources->Rapid Adoption Kits yet, you're missing out.  You'll find databases with detailed instructions, documentation and videos on many tools, features and flows.   They've become very popular and we're adding more all the time.

    We're also featuring content on routing, schematic PCells, ADE XL…

    • 18 Mar 2013
  • Verification: What to See at the DATE Conference: High-Level Synthesis

    Jack Erickson
    Jack Erickson
    The DATE (Design Automation and Test in Europe) Conference is next week (March 18-22, 2013) in Grenoble, France. If you are lucky enough to be in Grenoble at this time of year, it will be worth it to check out Session 11.2 "High-Level Synthesis ...
    • 14 Mar 2013
  • Verification: Specman: Getting Source Information on Macros

    teamspecman
    teamspecman

    When you write a define-as or define-as-computed e macro, you sometimes need the replacement code to contain or to depend on the source information regarding the specific macro call, including the source module and the source line number.

    For example, a macro may need to print source information, or it may need to create different code when used in one module than it needs to create when used in other modules.

    You can…

    • 12 Mar 2013
  • Verification: DVCon 2013: Functional Verification Is EDA’s “Killer App”

    jvh3
    jvh3

    With another year of record attendance, DVCon has again proven that a functional verification-focused mix of trade show and technical conference is what customers need to get their jobs done.  Here are some of the some of the highlights I took away from this informative event:

    DVCon 2013 was a one stop shop for panels, papers, posters,
    live demos, and tutorials on functional verification

    * Great panels on Verification Planning…

    • 10 Mar 2013
  • Digital Design: CDNLive High-Performance Track: Do You Have What it Takes to Get Your High-Performance SoC to Market?

    Vasu Madabushi
    Vasu Madabushi

    Implementing SoCs with embedded processors at advanced nodes has become increasingly difficult. This is due to the complexity of the design functionality as well as the low power and increased performance requirements driven by a plethora of end-user applications in modern hand-held devices. Path-breaking trends in ARMv8 64-bit processor based microservers for power efficient cloud computing/data centers and high-end…

    • 10 Mar 2013
  • Verification: System to Silicon Verification – CDNLive Gives a Reality Check on How Hardware and Software Meet

    fschirrmeister
    fschirrmeister
    Ever since switching from being a hardware/software chip developer to being an enabler with tools in EDA and embedded software, I was part of a team working towards methodologies and tools to improve the interaction of hardware and software. In Decem...
    • 8 Mar 2013
  • System, PCB, & Package Design : What's Good About Allegro PCB Editor Place Replicate Text Support? Check Out 16.6!

    Jerry GenPart
    Jerry GenPart

    The Allegro PCB Editor Place Replicate application now supports the processing of component reference designators. The work performed in customizing assembly text or silkscreen to the seed circuit can now be leveraged across the replicated modules.

    Read on for more details…


    In the image below there are two modules. The one on the left (U14, U15 and the associated capacitors) has the text moved to locations which…

    • 4 Mar 2013
  • System, PCB, & Package Design : Remove Die Stack Layers from NC Drill Outputs using Cadence 16.6 SiP and APD IC Packaging Tools

    Jeff Gallagher
    Jeff Gallagher
     As we continue with our series on improvements to the manufacturing and documentation outputs in the Cadence 16.6 IC Packaging layout tools, our focus this week is on NC Drill outputs. For as long as NC Drill data has been a part of the IC Pack...
    • 1 Mar 2013
  • Verification: Securing Invisible Things … or “Why Denial Works!”

    fschirrmeister
    fschirrmeister
    The opening keynote of the Embedded World conference in Germany left me with chills. No, it was not a grand theatrical performance letting me crave for more. It simply scared the bejevies out of me with respect to the safety and security of embe...
    • 27 Feb 2013
  • System, PCB, & Package Design : What's Good About Allegro AMS New Advanced Options? They’re in the 16.6 Release!

    Jerry GenPart
    Jerry GenPart

    The Allegro AMS Simulator (analog/mixed-signal) 16.6 release adds several enhancements to the Advanced Options dialog form. This enables the customizability of a PSpice simulation run, including control over convergence homotopy options, making worst-case analysis independent of RELTOL and enabling auto-convergence automatically in case of convergence failure. These options do not change the core behavior of the simulator…

    • 26 Feb 2013
  • Analog/Custom Design: "Smart Devices" and How They Affect Your Mixed-Signal SOC Verification

    Sathish Bala
    Sathish Bala

    We are seeing a huge trend -- the mobile revolution is changing the way we go about our everyday lives. Gone are the days where the term 'Internet'  was associated with a PC or Mac. The smartphone revolution has changed how  the data is consumed and used by consumers and businesses. For example, with the new line of smart systems, every device or appliance is connected to the Internet to manage their services in a…

    • 25 Feb 2013
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