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Latest Blog Posts

  • Breakfast Bytes: Which Passwords Should You Change?

    Paul McLellan
    Paul McLellan
    I was talking to someone who consults to Cadence on various aspects of security. He told me not to use his name...must be for security reasons. He had been reading some of my posts on passwords, in particular: Passwords: How Even Your Bank Doesn&#3...
    • 18 May 2020
  • Breakfast Bytes: Sunday Brunch Video for 17th May 2020

    Paul McLellan
    Paul McLellan
    https://youtu.be/We9eDDOn-Cg Made in "Instanbul" (camera Carey Guo) Monday: Why Create an SoC? Tuesday: Happy Birthday Florence Nightingale: Nurse, Statistician, Feminist Wednesday: John Park's Webinar on Chiplets Thursday: 3G and 4G: The Internet Ar...
    • 17 May 2020
  • PCB、IC封装:设计与仿真分析: 极致PCB设计全流程 I 技巧三:规则管理器应用技巧

    SDA China
    SDA China
    本期技巧篇内容与大家分享规则管理器(Allegro® Constraint Manager,简称CM)中输入数据的几个细节操作以及“信号不允许表层布线”的规则设置: 对于复杂PCB设计,规则比较多,规则设置更是一大挑战。关注CM中的细节操作,既能让您的设计更加高效,也可以避免数据输入失误 对于特殊设计——信号不能表层布线,通过本期技巧,为它们赋予相应规则,实现精准控制 关注微信公众号“Cadence楷登PCB及封装资源中心&...
    • 15 May 2020
  • PCB、IC封装:设计与仿真分析: 极致PCB设计全流程 I 基础三:有效进行规则设置

    SDA China
    SDA China
    规则驱动设计理念:通过正确抽象、完整设置的规则,为PCB设计质量保驾护航。 设计过程中,保证设计者的行为正确是至关重要的,如果规则出现问题,那么过程执行得再好都无济于事。 Good、Better、Best、Super,如果在这些级别中选出最贴切我们对Constraint Manager使用程度的描述,您会是在什么级别呢? “极致PCB设计全流程”第三期基础篇“有效进行规则设置”为您解答。 关注微信公众号“Cadence楷登PCB及封装资...
    • 15 May 2020
  • Life at Cadence: My Life at Cadence Video Series: Sneharsi Nag

    Mary Kasik
    Mary Kasik
    Cadence recently interviewed five of our amazing women engineers for a new video series titled, “My Life at Cadence”! This first video features Sneharsi Nag, Senior Applications Engineer. …the primary person who actually influence...
    • 15 May 2020
  • Digital Design: SSV 20.1 Base Release Now Available

    SSV Release Team
    SSV Release Team
    The SSV 20.1 production release is now available for download.
    • 15 May 2020
  • System, PCB, & Package Design : BoardSurfers: Three Steps to Using Embedded Components

    mrigashira
    mrigashira
    If you think embedding components in a PCB just reduces product size, well that's true but that's only half the truth. Embedding components also increases performance and reduces transmission loss. So it's about miniaturization and performance with e...
    • 15 May 2020
  • Breakfast Bytes: Tensilica HiFi DSPs with Dolby Atmos for Soundbars

    Paul McLellan
    Paul McLellan
    Do you know what a soundbar is? Years ago, if you wanted to build a good home theater then you'd need a TV projector (or a projection TV) costing over $10,000, and a set of expensive speakers to go with your Dolby 5.1 ("five point one&...
    • 15 May 2020
  • Digital Design: Library Characterization Tidbits: Reuse to Recharacterize - Improve Productivity with Liberate MX

    KamleshSinghDodiya
    KamleshSinghDodiya
    A write up on how Liberate MX effectively enables you to characterize only the failed or new arcs.
    • 15 May 2020
  • Verification: Catching up with Higher Ethernet Speed: VIP Supports 802.3ck

    Dave Huang
    Dave Huang

    Draft 1.0 of 802.3ck, also known as 100G per lane, was finally published by IEEE in Dec 2019.  This draft provided the standardization of higher lane speed support for backplane systems, including 3 speed mode variations: 100G, 200G, and 400G. Backplane Ethernet speed is increasing, evolving from 10G, 25G, 50G, to current 100G on a single SerDes lane within less than 10 years, offering unprecedented capacity for the datacenter…

    • 14 May 2020
  • Verification: Sizing Up eUSB2 Verification

    Dave Huang
    Dave Huang

    USB is one of the most widely used interfaces in the PC market for more than 20 years. Though it remains the same form in laptops and servers, it never stops its evolution in terms of capacity and speed. Embedded USB2.0, known as eUSB2, was created to address the concerns of power efficiency and portability. Although eUSB2 largely reuses USB2.0 protocol layer, the verification of eUSB2 can be never thought of as a miniature…

    • 14 May 2020
  • Verification: Why Is the Evolving HBM3 Such a Revolutionary Technology and How Can You Be Ready for It?

    Thierry Berdah
    Thierry Berdah

    Since 2013, we have seen the HBM specifications being released by JEDEC and companies announcing in the same month HBM products just like magic. How can these companies have a silicon-proven product altogether with newly announced official specifications? What is the secret process they use in order to be constantly first-in-market with these new technologies? And more important, what can YOU do in order to also be such…

    • 14 May 2020
  • Breakfast Bytes: 3G and 4G: The Internet Arrives

    Paul McLellan
    Paul McLellan
    In posts over the last couple of weeks, I covered 1G and 2G mobile: 1G Mobile: AMPS, TOPS, C-450, Radiocom 2000, and All Those Japanese Ones 2G: Mobile Goes Digital Today it is the turn of 3G, 3.5G, and 4G. I'll omit the angels-on-a-pinhead wa...
    • 14 May 2020
  • Breakfast Bytes: John Park's Webinar on Chiplets

    Paul McLellan
    Paul McLellan
    Recently Cadence's John Park presented a webinar on Design Methodologies for Next-Generation Advanced Multi-Chip(let) Packaging. Gordon Moore, famous for Moore's Law among other things, also predicted that this day would come. Over 50 years ag...
    • 13 May 2020
  • Analog/Custom Design: Virtuoso IC6.1.8 ISR11 and ICADVM18.1 ISR11 Now Available

    Virtuoso Release Team
    Virtuoso Release Team
    The IC6.1.8 ISR11 and ICADVM18.1 ISR11 production releases are now available for download.
    • 13 May 2020
  • System, PCB, & Package Design : New PCIe SI Challenges Conquered Using Clarity 3D Field Solver for PCB

    Sigrity
    Sigrity
    Figure 1: High-performance PCIe-based graphics card There is a trend in the data center industry moving toward heterogeneous computing in order to satisfy workloads that are computationally intensive. These trends are driving the development of soft...
    • 12 May 2020
  • System, PCB, & Package Design : IC Packagers: The Choice Between Static and Dynamic Shapes

    Tyler
    Tyler
    That title might be a touch misleading. We’re not here to talk about why to convert shapes between static and dynamic. Rather, I want to talk about why you should NOT be doing this. Every design has some conductor shapes in it (or at least a ve...
    • 12 May 2020
  • Breakfast Bytes: Happy Birthday Florence Nightingale: Nurse, Statistician, Feminist

    Paul McLellan
    Paul McLellan
    Today is the 200th anniversary of the birth of the first woman member of the Royal Statistical Society (in London, the title is unqualified since there were no other statistical societies). I've written a bit about her before in my post The Lady...
    • 12 May 2020
  • System, PCB, & Package Design : Challenges of On-Chip Thermal Analysis in Electronic System Designs

    CTKao
    CTKao
    In the beginning of our universe, enormous amount of heat or energy was generated and released during the period of 0 to 10-43 sec, in theory while backed up by models and measurements, about 13.8 billion years ago.  Since then, a variety of phy...
    • 11 May 2020
  • Analog/Custom Design: Virtuoso Meets Maxwell: Help with Electromagnetic Analysis - Part VI

    Kabir
    Kabir
    This is the last blog in the miniseries that aims at providing in-depth details of electromagnetic analysis in Virtuoso RF Solution. To learn about a few tips and tricks on the simulation setup, read more...
    • 11 May 2020
  • Breakfast Bytes: Why Create an SoC?

    Paul McLellan
    Paul McLellan
    I've been in the semiconductor and EDA industries for nearly forty years. One thing I've noticed that hasn't changed is that we love our chips and the tools to design them. Designing a chip that is a perfect match to a unique purpose is ...
    • 11 May 2020
  • Breakfast Bytes: Sunday Brunch Video for 10th May 2020

    Paul McLellan
    Paul McLellan
    https://youtu.be/feK4sISKChA Made on Communication Hill, San Jose (camera Carey Guo) Monday: Signoff in the Cloud Tuesday: Wally Rhines: Predicting Semiconductor Business Trends After Moore's Law Wednesday: Computational Software: A New...
    • 10 May 2020
  • System, PCB, & Package Design : BoardSurfers: Training Insights: Placing Parts Manually Using Design for Assembly (DFA) Rules

    Shreyansh
    Shreyansh
    So, what if you can figure out all that can go wrong when your product is being assembled early on? Not guess but know and correct at an early stage – not wait for the fabricator or manufacturer to send you a long report of what needs to change. That’s why Design for Assembly (DFA) rules
    • 8 May 2020
  • Breakfast Bytes: Hearables and Earbuds

    Paul McLellan
    Paul McLellan
    Do you have a set of Bluetooth earbuds yet? If not, you will. The iPhone was the first to kill the ubiquitous 3.5mm headphone jack, but many other manufacturers have quietly followed. Of course, various wired adapters are available, but the replacem...
    • 8 May 2020
  • Creative Ideas at Work Can Play a Big Part in Difficult Times

    Life at Cadence: Creative Ideas at Work Can Play a Big Part in Difficult Times

    Neil Zaman
    Neil Zaman
    In the blink of an eye, we entered into a new, virtual reality, and the rapidly shifting landscape is testing us in ways we never could have imagined. Our employees are stepping up and showing their best attributes. They’ve been sharply focused...
    • 7 May 2020
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