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Whiteboard Wednesdays: Whiteboard Wednesdays - Cadence Unveils 112G Long-Reach SerDes IP in 7nm Technology

References4U

With hyperscale datacenters requiring network switches delivering bandwidths of 12.8 Tbps and beyond, there is strong demand for 112G SerDes IP for the underlying ASICs and SoCs. In this week’s Whiteboard Wednesday, Wendy Wu explains the high-performance networking market drivers and introduces the Cadence® 112G Long-Reach SerDes IP implemented in 7nm process technology.

www.youtube.com/watch
- 24 Oct 2018
Breakfast Bytes: ERI: Hardware Security Workshop

Paul McLellan

The opening morning of DARPA's Electronic Resurgence Initiative summit in San Francisco consisted of several workshops, called "What's Next Workshops". I picked the hardware security workshop since the DoD cares more about security ...
- 24 Oct 2018
System, PCB, & Package Design : How To Maintain Connectivity in a Multi-Board PCB System

TeamAllegro

Today’s electronics often incorporate multiple interconnected printed circuit boards (PCB) into their designs. Getting all the components in a multi-board system to work together as a cohesive final product hinges on choosing the right connectors for the design. In this post, we’ll dive into the different types of PCB interconnects and some best practices for implementing them in your next multi-board PCB project.
- 23 Oct 2018
Breakfast Bytes: Arm TechCon: Get Ready for the NEOVERSE

Paul McLellan

I don't know if it was the vibe Arm's marketing was going for, but if you wanted to evoke The Matrix without infringing any copyrights, The NEOVERSE does the trick. It's hard to believe but The Matrix will be twenty years old next ye...
- 23 Oct 2018
Breakfast Bytes: The World's First Working 7nm 112G Long Reach SerDes Silicon

Paul McLellan

At the start of November last year, Cadence announced that it was acquiring nusemi, a company focused on the development of high-speed SerDes interfaces. Today, Cadence demonstrated working 7nm SerDes testchips running at 112 Gbps. It ...
- 22 Oct 2018
PCB、IC封装：设计与仿真分析: 升级到Allegro17.2-2016的10大理由之8：过孔结构——下一代高速布线解决方案

TeamAllegro

过孔转换对信号布线来说十分常见。在高速设计中过孔转换是造成PCB互连中信号衰减的主要原因。而且高速通道需要地孔临近关键信号，在信号走线换层时，提供连续的回流路径，来降低信号损耗。（点击查看大图） space 如果您是一位PCB设计工程师，您会非常清楚，实现符合需求的布局布线很复杂、很花时间。现有的方法常常是手动的、冗长的，容易造成布局布线错误或丢失。我们很容易忘记在关键信号添加回流孔，或者移除关键信号走线之后遗留下的回流孔。此外，布线换层时，在高速差分对周围添加定制的过孔也是非常繁琐的手动过...
- 19 Oct 2018
System, PCB, & Package Design : How is a Multi-board PCB System Assembly Different from Rigid-Flex Assembly

TeamAllegro

When people typically think of multi-board PCB design, they tend to picture racks of boards in server farms or the components of a gaming rig. But what if your typical rigid boards don’t fit within the physical envelope of your multi-board application? Do you pay a premium for flexible circuitry? What if you could have the best of both worlds?
- 19 Oct 2018
Breakfast Bytes: The DARPA Electronic Resurgence Initiative (ERI)

Paul McLellan

Many weeks ago DARPA organized a summit at the Palace of Fine Arts in San Francisco. The first day consisted of a workshop and some other presentations, including one by Cadence's Tom Beckley. Since Tom's presentation was very similar to what he...
- 19 Oct 2018
Analog/Custom Design: Virtuoso IC6.1.8 and ICADVM18.1 Now Available

Virtuoso Release Team

The IC6.1.8 and ICADVM18.1 production releases are now available for download. To find out what new and enhanced features have been introduced, click here…
- 18 Oct 2018
Breakfast Bytes: CDNLive Israel 2018

Paul McLellan

This week it was the last CDNLive of the year, CDNLive Israel in Tel Aviv. From my point of view the show ran perfectly. But I'm always reminded of that description of a swan as "serene on top and furiously paddling underneath." I reali...
- 18 Oct 2018
Breakfast Bytes: Jasper User Group 2018

Paul McLellan

This week it is CDNLive Israel. But last week it was Jasper User Group (JUG). At it happens, Jasper was one of the early companies to sign up with SemiWiki when we started it, so I've been going to Jasper User Group for longer than either I'v...
- 17 Oct 2018
Digital Design: What's in it for Me in Innovus 18.10 Release?

MJ Cad

At advanced nodes, there’s always a deep conflict between power, performance, and area (PPA) and design turnaround time (TAT). You already know Innovus Implementation System very smartly delivers PPA advantage and accelerates digital design TAT through various features, including its full-flow massively parallel architecture. Innovus 18.10 release takes all these benefits even further. In this blog, I will start with…
- 16 Oct 2018
Breakfast Bytes: Of Arms and the Man I Sing

Paul McLellan

Arma virumque cano—of arms and the man I sing. This is the famous opening line of Virgil's Aeneid, the curse of many a schoolboy's Latin learning days, mine included. Anyway, the reason for all this talk about arms (Arma) is that today is ...
- 16 Oct 2018
Verification: Learn How Valens uses Specman Macros Automate Configuration of Verification Environments at DVCon EMEA Next Week

Steve Brown

Valens has achieved success through applying Specman to their verification projects. At DVCon EMEA (Oct 24-25) you can learn how their use of Specman Macros to automate configuration of the verification environment to their design. This saves them effort and lowers the learning curve for engineers who jump from project to project. In collaboration with Veriest Verification Ltd, a Cadence Connections Verification partner…
- 16 Oct 2018
System, PCB, & Package Design : Real World (Unexpected) Examples of Multi-Board PCB Systems

TeamAllegro

What do reusable rockets, self-driving cars, and the blockchain have in common? Besides breaching major milestones in the last 3-5 years, they are all stellar examples of how advancements in multi-board printed circuit board (PCB) design is propelling us into the future. In this post we’ll look at how advances in multi-board PCB systems are helping push the boundaries of spaceflight, autonomous vehicles, and the blockchain…
- 16 Oct 2018
Breakfast Bytes: DDR5 Is on Our Doorstep

Paul McLellan

The talk of the town in the DRAM market (well, apart from its growth in the last couple of years) is DDR5. You might assume from the talk that JEDEC has finalized the standard, but it is actually technically still in development. I believe that the f...
- 15 Oct 2018
Breakfast Bytes: ESD Alliance Workshop on Digital Marketing: Tools and Sales

Paul McLellan

Yesterday was the first part about the ESD Alliance Digital Marketing workshop. Today, it is part 2 (of 2). Nicolas Part 2: Training and Tools Today's marketers need to be hands-on since there are a lot of different aspects and it is too slow (no...
- 12 Oct 2018
Spotlight Taiwan: Snapshots of CDNLive Taiwan 2018

candyyu

Taiwan is one of the most important hubs for the global semiconductor industry. Served as an annual important event for Cadence in Taiwan, with the efforts to provide tailored lineups for local industry, this year’s CDNLive Taiwan has suc...
- 11 Oct 2018
PCB、IC封装：设计与仿真分析: 升级到Allegro17.2-2016的10大理由之7：梯形凸块布线——下一代高速布线解决方案

TeamAllegro

通过梯形凸块布线高效利用布线通道梯形凸块布线是一种新方法，可以通过在并行走线上添加梯形形状来控制引脚区域或者突破区域的阻抗，减少开放区域的串扰。这是一个突破性的布线策略，可应对更长、更密的布线。（点击查看大图）不幸的是，这一新的布线技术增加了PCB设计的复杂度，在后续的设计流程中管理这些梯形凸块也很痛苦。我们听到了你们的求助，PCB layout工程师欢欣鼓舞！除了提供生成梯形凸块的方法，我们覆盖了梯形凸块的整个“生命周期”，几大特性如下：生成梯...
- 11 Oct 2018
Breakfast Bytes: ESD Alliance Workshop on Digital Marketing: Agility

Paul McLellan

Last week the ESD Alliance ran another workshop on digital marketing, with Nicolas Athanasopoulos of OneSpin and Dave Kelf (now at Breker, but who used to work with Nicolas at OneSpin). Unfortunately, they picked the same day as TSMC's OIP sympos...
- 11 Oct 2018
SoC and IP: NXP Introduces Tensilica HiFi 4 DSP-based Platforms to Secure IoT Edge Devices

PaulaJones

Trust. Privacy. Confidentiality. These are three important concerns for designers of IoT edge devices. Today NXP announced that they are addressing these concerns with two new platforms that feature secure execution environment (SEE) to give developers access to “unprecedented” security capabilities.

These platforms provide a multi-layered, hardware-enabled protection scheme to secure IoT edge devices and…
- 10 Oct 2018
Breakfast Bytes: Azure for Silicon Design with Cadence and TSMC

Paul McLellan

I used to live on the Cote d'Azur, which is what everyone else calls the French Riviera. The name comes from the blue color of the Mediterranean Sea, azur in French. In English, it is azure. But it is probably more well-known today as the name o...
- 10 Oct 2018
Whiteboard Wednesdays: Whiteboard Wednesdays - Tensilica Neural Network Compiler: An Offline Tool for Efficient Deployment of Neural Networks

References4U

In this week’s Whiteboard Wednesdays video, Megha Daga describes how the Tensilica Neural Network Compiler works, from a trained floating-point network to an optimized source code generation for a Tensilica AI-enabled DSP or processor.

https://youtu.be/V9BV_BLIUiI
- 9 Oct 2018
System, PCB, & Package Design : How To Maintain Connectivity in a Multiboard PCB System

TeamAllegro
By John Burkhert Jr

Bringing a multiboard system together is a chance for the designer to spread their wings. As the circuit spreads, so do the risk of crossed signals. Some of the ways the circuits can get scrambled include:

Some connector vendors have clear indications of polarity. Others leave all numbering to the buyer. In the same way, a row of gold fingers will be anything we draw up in terms of pin numbers and…
- 9 Oct 2018
Breakfast Bytes: David White and Machine Learning

Paul McLellan

Recently Cadence held a worldwide event for our interns. To read more about our intern program, see my post CHIPs in the Cadence Cafeteria. The number varies almost on a day-to-day basis, but when I wrote that post we had 259 interns at 13 different ...
- 9 Oct 2018

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