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Traditionally, you would do power, performance, area, and congestion (PPAC) analysis for a design as you move forward with different stages in the flow.

But with highly advanced technology, the real designs are getting complex and interdependent, complicating the analysis at each stage!! Hence, attaining PPAC goals can be very convoluted and crucial as the clock keeps ticking for the tapeout time. What is the challenge…

Analog Layout remains a time consuming manual task to most layout designers. For as long as integrated circuits have existed, designers have been manually placing individual transistors, drawing every shape and guard ring, and routing every wire by hand. Digital layout automation on the other hand, became almost completely automated. As early as the mid 1980’s EDA pioneers at Tangent Systems allowed digital blocks with…

CXL 3.0 is an open-standard interconnect technology that builds upon PCIe 6.0 to facilitate high-speed communication between CPUs and peripheral devices. With a doubled bandwidth of 64 GT/s and enhanced fabric capabilities, CXL 3.0 aims to optimize system-level flows, improve resource utilization, and enable new device types for composable disaggregated infrastructure.

The global chip market has seen a significant increase in demand for high-performance chips due to the rapid growth of the automotive industry. This growth is primarily driven by the adoption of advanced driver-assistance systems (ADAS), electric vehicles (EVs), and connected cars. These technologies require fast data processing, improved sensor fusion, and better communication capabilities to enhance vehicle performance…

The SSV 23.1 release comes with a brand-new content delivery application called Cadence Doc Assistant, shortened to Doc Assistant, the next-gen app for content searching, navigation, and presentation.

Doc Assistant, with its simplified content classification and standardized content, smoothens the content discovery process to ensure that you get the help you seek with minimal effort and maximum speed and accuracy. This…

Are you excited to know more about the Virtuoso Digital Implementation flow, which is recommended especially for small digital blocks? Are you working on mixed-signal designs? Well, read on to know how to use this flow to implement your digital blocks!

Virtuoso Digital Implementation is a license package built for the digital implementation platform. It helps design digital circuits…

This two-day training course focuses on transient noise simulations using the Spectre simulator inside the Virtuoso Analog Design Environment (ADE) Suite. The course is characterized in the following modules:

• Introduction to transient noise analysis: In this introductory module of the course, you explore topics such as transient analysis, different noise analyses in Spectre, and transient noise analysis. You'll also learn…

The need for higher processing power and lower power consumption are driving processors and System on Chip (SoC) to more advanced lower process nodes. For SoCs operating at 1.2V supply that are suitable for mobile phones, tablets, and laptops, using USB2 interfaces is a challenge as it becomes difficult to support 3.3V IO cells. A low voltage USB2.0 solution is therefore required to address the gap.

The embedded USB2…

Heterogeneous integration is changing system design and analysis. Simply following Moore’s Law is no longer the best technical and economical path forward. Technology breakthroughs in semiconductor packaging are key to transforming chips into heterogeneously integrated 3D systems. The convergence of systems and chips is leading to new workforce challenges and extremely complex design flows.

Learn more about the…