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Verification: Ethernet Encryption: Harnessing the Power of IPSec Shields

Krunal Patel

In the ever-expanding domain of interconnected devices and digital communication, ensuring the security of data transmission has become paramount. One robust solution that stands at the forefront is the integration of IPSec with ethernet.

Internet Protocol Security (IPSec) operates at the network layer of the OSI model, providing a suite of protocols for securing communication over IP networks. It is commonly used to…
- 22 Nov 2023
Artificial Intelligence (AI): AI-Driven Chip Development for a Better Tomorrow

Reela Samuel

As we approach Thanksgiving, it's worth reflecting on the many things we must be grateful for. Among them is the world of technology, which is constantly innovating to bring about a more sustainable future. One area where this is particularly eviden...
- 21 Nov 2023
データセンター: デジタルツイン：データセンターの熱問題に対処するための6つのステップ

Data Center Japan

気流と冷却の複雑さや、各IT機器を適切な温度に保つ必要性を踏まえると、データセンターのデジタルツインでは熱流体解析（CFD）を活用して、気流と冷却の高精度なシミュレーションを行う必要があります。このブログでは、データセンターの設計と運用管理にデジタルツインを使用すると得られる利点を紹介しています。
- 21 Nov 2023
System, PCB, & Package Design : BoardSurfers: Allegro SKILL Database Objects

Kirti Sikri

Allegro PCB Editor stores design data as various types of objects in a proprietary database format. These object types can create a complete representation of an electronic circuit. You can create, operate on, and extract information from the databas...
- 21 Nov 2023
System, PCB, & Package Design : BoardSurfers: What’s New in Allegro X Layout Editors in Release 23.1

Dhruv Prakash

Release 23.1 introduces several new features and enhancements in the two layout editors, Allegro X PCB Editor and Allegro X Advanced Package Designer. These changes are geared to make the design process smoother and smarter for you with condensed tim...
- 21 Nov 2023
Spotlight Taiwan: Cadence Wins TCSA Top 10 Foreign Sustainable Model Companies Award

candyyu

Cadence Design Systems, Inc. announced that it has won the Top 10 Foreign Sustainable Model Companies Award from Taiwan Institute for Sustainable Energy (TAISE) for its continuous efforts in promoting Taiwan’s sustainability by enabling electro...
- 20 Nov 2023
Verification: Leveraging AI to Optimize the Debug Productivity and Verification Throughput

Vinod Khera

The impact of semiconductors on various sectors cannot be overstated. Semiconductors have revolutionized our operations from the automotive industry to IoT, communication, and HPC. However, as demand for high performance and instant gratification inc...
- 19 Nov 2023
Spotlight Taiwan: Cadence榮獲「台灣十大永續典範外商企業獎」

candyyu

Cadence日前榮獲由台灣永續能源研究基金會舉辦之2023 第十六屆台灣企業永續獎(TCSA)，以智慧系統策略致力研發、永續創新、深耕培育，人才永續，推動電子設計創新、協助台灣產業邁向綠色永續轉型，而榮獲「台灣十大永續典範外商企業獎(Top 10 Foreign Sustainable Model Companies Award)」，頒獎典禮於11月15日假圓山飯店盛大隆重舉行。 Cadence長期專注研發具有功耗意識、低功耗節能、提早熱分析的運算軟體，於電子產品開發的早期即優化電子設備的功耗...
- 17 Nov 2023
System, PCB, & Package Design : How to Get Started with Model-Based Systems Engineering

NaomiM

What is model-based systems engineering (MBSE)? How does it contribute to the engineering design process? The MBSE approach to system design focuses on creating and using models to define and visualize the system architecture, requirements, behavior, and other aspects. It's a methodology that uses models as central artifacts throughout the engineering process. Overall, the goal of MBSE is to improve the efficiency and…
- 17 Nov 2023
Computational Fluid Dynamics: Women in CFD with Sainan Lu

Veena Parthan

In this month's edition of the Women in CFD series, we are excited to feature Sainan Lu, lead product engineer for the Cadence Celsius Thermal and Celsius EC Solver. Her remarkable career journey in the field of computational fluid dynamics (CFD) is an inspiration to many women in engineering.
- 17 Nov 2023
Verification: Insights Into the Evolutions and Optimizations of PCIe 6.0

Gustavo Araujo

The PCIe protocol (Peripheral Component Interconnect Express) had its first generation in 2003, being a huge breakthrough in the industry by allowing up to 2.5 GT/s per lane in a serial computer expansion bus. The protocol has since evolved many times, always doubling its transfer rate compared to the previous generation and bringing new features and optimizations whenever needed.

The latest release was announced in 2022…
- 16 Nov 2023
System, PCB, & Package Design : BoardSurfers: Training Insights: DFM-Aware PCB Design Using Allegro DesignTrue DFM Technology

anandd

Identifying critical DFM issues late in the design cycle can result in a complete rework of your PCB layout. Missing critical manufacturing rules can lead to the board being scrapped, costly rework, and time-to-market delays. Allegro DesignTrue ...
- 16 Nov 2023
Analog/Custom Design: Virtuoso Studio IC23.1 ISR3 Now Available

Virtuoso Release Team

Virtuoso Studio IC23.1 ISR3 production release is now available for download.
- 16 Nov 2023
Digital Design: Voltus Voice: Elevate Your Power Signoff Approach Using 3D Vector Profiling

Priyanka Ruhil

Performing vectored power analysis on localized high power consumption regions of microchip
- 15 Nov 2023
Analog/Custom Design: Analog Layout – Not Just Transistors

Mark Williams

Look at any schematic for a CMOS Analog IC circuit and you will see symbols for NMOS and PMOS transistors as well as resistors, capacitors, and inductors. You will also see the wires joining the symbols together that define the circuit connectivity. At a basic level creating a layout for a circuit is the process of drawing the silicon geometry for these symbols, and connecting them together with wires. In most cases,…
- 15 Nov 2023
Computational Fluid Dynamics: Savor the ‘Cheerios Effect’ in Your Cereal Bowl!

Veena Parthan

Ever wondered why your Cheerios seem to stick together in your morning bowl of milk? It turns out that this phenomenon has a name: the Cheerios effect. This same fluid physics is at work when you see pollen floating on the surface of a pond or a frothy head on your favorite beer. So, next time you're enjoying a bowl of Cheerios, take a moment to appreciate the amazing physics at play!
- 14 Nov 2023
Digital Design: Training Insights Webinar: Designing a Complete Chip Using the RTL-to-GDSII Flow

P Saisrinivas

Would you like to know how to design a complete chip using the RTL-to-GDSII flow? Please join me, Cadence Training and application engineer Sai Srinivas Pamula, for this free technical Training Webinar, RTL-to-GDSII Flow for ASIC Design Using Cadence Tools.

What Is This Webinar About?
In this free technical Training Webinar, we'll teach you the essential steps in the RTL-to-GDSII design flow using a wide variety of industry…
- 13 Nov 2023
Data Center: Digital Transformation’s Impact on Data Centers

Danielle Gibson

Digital transformation, or the process of replacing standard or manual business procedures with digital counterparts, is fundamental to scalable operations in the digital era. The process of integrating digital technology into all business areas com...
- 13 Nov 2023
Verification: Maximise Verification Reuse with Cadence Perspec System Verifier

Vinod Khera

Are You Tired of Countless Hours Manually Creating Complex System-Level Coverage-Driven Tests to Verify Your SoC? During the verification process, teams often work independently, creating test suits from block level to subsystems and SoC. This result...
- 12 Nov 2023
PCB解析／ICパッケージ解析: Sigrity and Systems Analysis 2023.1 HF2リリース！

SPB Japan

Sigrity & Systems Analysis (SIGRITY/SYSANLS) 2023.1 HF2リリースが Cadence Downloads サイトからダウンロード可能となりました。このリリースで改修された項目は、インストールに含まれているREADME.txtをご参照ください。 SIGRITY/SYSANLS 2023.1 HF2 ここにSIGRITY/SYSANLS 2023.1 HF2リリースの主要なアップデート内容をいくつかリストしました。このリリースに含まれる...
- 9 Nov 2023
PCB解析／ICパッケージ解析: System Analysis Knowledge Bytes: Clarity 3D Solverコースの案内

SPB Japan

Clarity 3D Solverコースでは、Clarity 3D Solverを使用するために必要なトレーニングを提供します。このコースでは、Clarity 3D LayoutとClarity 3D Workbenchの両方を説明します。Clarity 3D Layoutは、ICパッケージやPCBレイアウトなどの層構造のSパラメータモデル抽出向けのツールになります。他の一般的な3D有限要素解析ツールよりも、はるかに高速かつ正確なEMソリューションを提供します。Clarity 3D Workbe...
- 9 Nov 2023
PCB解析／ICパッケージ解析: Training Webinar: Celsius Thermal Solver: Electrical and Thermal Co-Simulationウェビナーの公開！

SPB Japan

Cadence Celsius Thermal Solverは、IC から物理的エンクロージャに至る電子システムを対象とした業界初の電熱協調解析ソリューションです。革新的なマルチフィジックス技術を利用したCelsius Thermal Solverは、固体構造の有限要素解析(FEA)と流体の数値流体力学(CFD)を組み合わせるシステム解析を可能にします。私は最近、Celsius Thermal Solver: Electrical and Thermal Co-Simulation に関する...
- 9 Nov 2023
PCB解析／ICパッケージ解析: CadenceTECHTALK: 3D-ICインターポーザ―向けSignal Integrityソリューション

SPB Japan

3D-IC設計では、熱や電力供給, シグナル・インテグリティ(SI)を早期に解析する必要があります。このCadenceTECHTALKでは、ヘテロジニアス・チップレットを解析するプロセスを紹介します。3D FEM抽出によって正確にモデル化されるシリコン設計データから始まる統合ワークフローについて学ぶことができます。 CadenceのプロダクトマネージャーのディレクターであるGary Lytle氏が、Cadence Multiphysics解析製品(Clarity, Celius, EMX Pl...
- 9 Nov 2023
Life at Cadence: DEI@Cadence: Spotlighting Cadence Veterans and Their Transitions to Tech

Ryan Robello

Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our One-Team culture at Cadence. In the DEI@Cadence blog series, you’ll hear the many unique perspectives and experiences of our global employees....
- 9 Nov 2023
Corporate News: Spirent Is Bringing Chipset Testing to Pre-Silicon Verification with Cadence

Tanushri Shah

Spirent is a global provider of automated testing and assurance solutions for networks, security, and positioning. This means that the technology that we rely on every day, from our smartphones to streaming services, is being tested by Spirent. To do...
- 9 Nov 2023

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