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System, PCB, & Package Design : IC Packagers: Mysteries Revealed - Why Is Flip-Chip Chip-Down the Default Library Die Orientation?

Tyler

We’ve come to the end of my New Year’s Resolutions for 2020. Before we dive deeper into the exciting new capabilities to be found in the 17.4 release, though, I’d like to address a question I hear from new users all the time. That q...
- 28 Jan 2020
Breakfast Bytes: IEDM: Novel Interconnect Techniques Beyond 3nm

Paul McLellan

During the short course on the Sunday before IEDM, Chris Wilson of imec presented Novel Interconnect Techniques for Advanced Devices Beyond 3nm. In some ways, this is a complementary presentation to the one given by TSMC that I covered last week in I...
- 28 Jan 2020
Breakfast Bytes: RIP Clayton Christensen

Paul McLellan

Clayton Christensen died last Thursday, at the relatively young age of 67. He was the author of what I think is the best book on strategy for high-tech organizations, The Innovator's Dilemma. I have purchased several copies since I first read it,...
- 27 Jan 2020
Analog/Custom Design: Virtuosity: Reminiscing About The Last 'Teen' Year of Custom IC Design Blogs

Dishika Majumdar

If you have missed reading any of our Virtuosity, Virtuoso Meets Maxwell, Virtuoso Video Diary blogs that were published in 2019, or you would like to go back to an ISR release announcement to see what were the featured enhancements, here's your chance to bookmark this blog for all that interesting information and for some of our most-viewed posts from the last year. Also, stay tuned to our new content arriving soon.
- 24 Jan 2020
Breakfast Bytes: IEDM: TSMC on 3nm Device Options

Paul McLellan

At IEDM in December, Jin Cai of TSMC presented Device Technology for 3nm Node and Beyond during the short course on Sunday. He divided his presentation up into four parts: Historical CMOS scaling trends FinFET improvements Nanosheet advantages ...
- 24 Jan 2020
System, PCB, & Package Design : BoardSurfers: Leveraging IPC-2581 Spec Element Capabilities to Streamline Design and Manufacturing Relationship

Monika

If you are a PCB designer and follow IPC-2581 guidelines to design a board, this soluti....
- 23 Jan 2020
Breakfast Bytes: DesignCon 2020: SI, PCB, Packaging, Photonics

Paul McLellan

Next Tuesday through Thursday, January 28 to 30, DesignCon 2020 takes place in the Santa Clara Convention Center. it is actually their 25th anniversary. I think of DesignCon as being about everything other than chip design, but increasingly the focus...
- 23 Jan 2020
System, PCB, & Package Design : DATA Pulse: Simplify Your ECAD Data Release Process While Ensuring Process Control

Auromala

Do you dread your ECAD to PLM publishing process? If yes, worry not. We have a solution.
- 22 Jan 2020
Breakfast Bytes: IEDM: Automating DTCO for 3nm

Paul McLellan

At IEDM in December, Lars Liebmann of TEL presented Design Technology Co-Optimization for 3nm and Beyond. The challenge in designing a modern process is that scaling is no longer based on incremental change purely at the process level. Design Te...
- 22 Jan 2020
定制IC芯片设计 : Virtuosity：Modgen中的布局重用流程

Aneesh Shastry

Modgen 现在支持布局重用流. 请继续阅读，了解如何使用此功能通过减少创建 Modgen 的时间和精力来提高版图效率.
- 21 Jan 2020
System, PCB, & Package Design : IC Packagers: Symbol Editing in IC Packages - Choose the Right Option

Tyler

When you need to make an edit to a component, whether that is the BGA footprint in need of a pin #1 padstack change for reference of adjustments to the entire bump layout of a flip-chip to feed routability changes back to the IC design team, there ar...
- 21 Jan 2020
Breakfast Bytes: A Big Problem with Big Data

Paul McLellan

I happened to read a blog post that referred to a 2018 paper in The Annals of Applied Statistics with the title Statistical Paradises and Paradoxes in Big Data: Law of Large Populations, Big Data Paradox, and the 2016 Presidential Election. The ...
- 21 Jan 2020
定制IC芯片设计 : 技术性：器件的自动布局和布线 — 基于行的器件放置

Sravasti

Device-level automatic placer允许您以约束和网格兼容的方式放置器件和设备组. 您可以使用交互式设备放置选项半自动放置设备.
- 21 Jan 2020
Breakfast Bytes: Sunday Brunch Video for 19th January 2020

Paul McLellan

https://youtu.be/O90mUZyWIeE Made at Lick Observatory (camera Carey Guo) Monday: Details of TSMC's IEDM Presentation on N5 Tuesday: Mark Cuban on Media and AI Wednesday: 5G in 2020 Thursday: Emerging Memory Friday: Off-topic: Picas...
- 19 Jan 2020
Breakfast Bytes: Off-Topic: Picas, Points, and Printing

Paul McLellan

Monday is Martin Luther King, Jr Day, and Cadence will be off. Breakfast Bytes will not appear. And so today is the last day before a holiday, and so I write about something off-topic. Today, printing. In fact, it is not totally off-topic since print...
- 17 Jan 2020
定制IC芯片设计 : Virtuoso视频日记：简单的方法来解决复杂的问题——schTraceNet

sarahfino

基于SKILL函数 schTraceNet 定义一个回调函数，将被探测的信号带入到下一层，这样就可以解决层次化原理图设计中遇到的复杂问题。
- 16 Jan 2020
Breakfast Bytes: Emerging Memory

Paul McLellan

SNIA, the Storage Networking Industry Association, organized a webinar recently with industry analysts Tom Coughlin (of Coughlin Associates) and Jim Handy (of Objective Analysis). The webinar was about emerging memories, meaning MRAM (magnetic), ReRA...
- 16 Jan 2020
The India Circuit: Of Brains and Computers: Keynote by Dr Jan Rabaey

Madhavi Rao

One of the industry’s biggest events, the VLSI Design Conference, took place in Bangalore last week. This conference does a round-robin of cities, and this was the 10th time in its 33-year history that Bangalore was hosting it (the last time wa...
- 15 Jan 2020
Breakfast Bytes: 5G in 2020

Paul McLellan

There is a famous quote, attributed to Mark Twain but more likely said by his friend Charles Dudley Warner: Everybody talks about the weather but nobody does anything about it. I think that 5G in 2020 is going to be like that. You will hear lots of...
- 15 Jan 2020
System, PCB, & Package Design : BoardSurfers: DFF - Three Steps to Perfect Mask Defined Padstacks in Your PCB

mrigashira

We will of course not venture into the finer points of the debate about mask-defined pins (SMD) and metal-defined pins (NSMD) but assume that for whatever reasons, we have mask-defined pins in our design and we want our design to be to be fabricated correctly and as....
- 14 Jan 2020
System, PCB, & Package Design : IC Packagers: The Default Bond Wire Profile - PROFILE1 (And Three Reasons Why Not to Use It)

Tyler

For those of you who do wire-bond package substrate – whether you’re designing a single-chip leadframe, a multi-die memory stack, or a complex stack with wire-bonds, flip-chips, interposers, and spacers all in one – you need wire pr...
- 14 Jan 2020
Breakfast Bytes: Mark Cuban on Media and AI

Paul McLellan

At CES there was a session in which Mark Cuban was interviewed. As he pointed out, he used to be most famous for being an entrepreneur, and then it was because he was the owner of the Mavericks basketball team, and now it is mostly his appearances on...
- 14 Jan 2020
定制IC芯片设计 : Virtuosity: 针对高阶工艺节点的器件级布线工具— 树型布线流程

Parula

本博客是Virtuoso器件级布线系列博客的最终篇，将介绍树干和树枝形成树的完整过程，通过这种类比方式，便于用户全面了解Tree Route 的流程及其功能. 前文回顾在进入本篇博客前，让我们回顾下之前的相关博客：
- 13 Jan 2020
Breakfast Bytes: Details of TSMC's IEDM Presentation on N5

Paul McLellan

At IEDM in December, one of the papers in the very last session (a sneaky trick to get us all to stay) was TSMC announcing their 5nm process. The paper actually had the cumbersome title 5nm CMOS Production Technology Platform Featuring Full-Fled...
- 13 Jan 2020
Breakfast Bytes: Sunday Brunch Video for 12th January 2020

Paul McLellan

https://youtu.be/y62D4tVK-_k Made at CES 2020 (camera Gerard Andrews) Last Thursday: The History of Lithography, Part 1: From Stones to Lasers Last Friday: The History of Lithography, Part 2: From Double-Patterning to EUV Monday: Proti...
- 12 Jan 2020

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