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Latest Blog Posts

  • Analog/Custom Design: Virtuoso Meets Maxwell: Package PDK in Virtuoso! How Is it even possible!? (Part 1)

    VRF Knight
    VRF Knight
    You heard it right! Virtuoso now supports Package and Board level designs; therefore, it has capabilities to import/create Package PDKs and libraries in Virtuoso. I have been working at Cadence for the past five years, in four out of these five years I have been mainly focused on our Intelligent System Design Solutions for High-Speed and RF Designs, specifically on how to create and maintain Package PDKs in Virtuoso.…
    • 7 Oct 2019
  • Breakfast Bytes: What Is Quantum Supremacy?

    Paul McLellan
    Paul McLellan
    There are rumors that Google has achieved quantum supremacy. According to Scott Aaronson, my go-to person for all things quantum mechanics, we weren't meant to know about this yet. As Scott says on his blog: As the world now knows, Google is ind...
    • 7 Oct 2019
  • Breakfast Bytes: Sunday Brunch Video for 6th October 2019

    Paul McLellan
    Paul McLellan
    https://youtu.be/zEmNTM72GYE Made at Sawyer Camp Trail (camera Carey Guo) Monday: TSMC OIP: Process Status Tuesday: The 2019 Kaufman Award Goes to Mary Jane Irwin Wednesday: HOT CHIPS: The AWS Nitro Project Thursday: GLOBALFOUNDRIES Technology C...
    • 6 Oct 2019
  • Academic Network: Student Story: Min-Chun's Contribution to Cell-Aware Test

    Kira Jones
    Kira Jones
    Let me introduce myself. My name is Min-Chun Hu, a master student majoring in electrical engineering (EE) at the National Tsing-Hua University (NTHU) in Hsinchu, Taiwan. Currently I am doing a nine-month internship at the world-renowned research inst...
    • 4 Oct 2019
  • PCB、IC封装:设计与仿真分析: 关于PCB设计倒角需要了解的一切

    TeamAllegro
    TeamAllegro
    将任意一个角落切掉,便能得到一个倒角。从儿童防护桌到泰姬陵的标志性外墙,人类通过倒角来解决与角相关的功能和美学问题由来已久。 使两个表面以90°以外的角度,尤其是45°相交时,便产生了倒角; 但倒角终止于平边,而不是一个点,这具有“倒圆”角的效果。 以下是PCB设计中需要倒角的两个常见原因: 第一个原因相对简单——正在构建的PCB拟采用边缘连接器(如PCI)。 第二个原因稍微复杂——这有关一种通常广受吹捧...
    • 4 Oct 2019
  • Breakfast Bytes: EDA in the Cloud: Astera Labs, AWS, Arm, and Cadence Report

    Paul McLellan
    Paul McLellan
    Earlier this week I wrote a post covering the AWS presentation from HOT CHIPS about the Nitro project. Although the Nitro chips all contain Arm processors, that doesn't make them "Arm servers" in the sense that the processor running the application c...
    • 4 Oct 2019
  • Analog/Custom Design: Virtuoso Video Diary: Multi-Technology Simulation—The Good has Changed for Better

    Udit Rajput
    Udit Rajput
    This blog highlights the recent enhancements made to the Multi-Technology Simulation (MTS) feature.
    • 3 Oct 2019
  • Breakfast Bytes: GLOBALFOUNDRIES Technology Conference 2019

    Paul McLellan
    Paul McLellan
    This week was the GLOBALFOUNDRIES Technology Conference, GTC 2019, in Santa Clara. It was the 10th anniversary of GF, which was created on March 4, 2009. it is also almost exactly one year since what GF calls "the pivot", where they decided to abando...
    • 3 Oct 2019
  • Breakfast Bytes: HOT CHIPS: The AWS Nitro Project

    Paul McLellan
    Paul McLellan
    In 2016, Amazon acquired the Israeli company Annapurna Labs. Since they were in stealth mode, doing something to do with Arm processors, nobody really knew why. At the time, press reports called them "secretive chip maker Annapurna". Last year, at CD...
    • 2 Oct 2019
  • Whiteboard Wednesdays: Whiteboard Wednesdays - An Intuitive Introduction to Finite Element Analysis (FEA) for Electrical Engineers, Part 2

    References4U
    References4U

    In this week's Whiteboard Wednesdays video, Tom Hackett continues his introduction to finite element analysis (FEA) and the important role it can play in electronics deign. For a detailed explanation of the mathematics behind Finite Element Analysis, see this excellent video by Grasp Engineering:  Practical Introduction and Basics of Finite Element Analysis

    www.youtube.com/watch

    • 1 Oct 2019
  • System, PCB, & Package Design : IC Packagers: Wrap Your Hands Around a Coil

    Tyler
    Tyler
    Coils are a design element that, if not exceedingly common, are showing up in more designs these days. They appear simple at first glance, but keeping a consistent air gap between each revolution of the spiral can involve a lot of mental arithmetic and picks in the design canvas. Here's how to do this with a few short clicks?
    • 1 Oct 2019
  • Breakfast Bytes: The 2019 Kaufman Award Goes to Mary Jane Irwin

    Paul McLellan
    Paul McLellan
    This year's Kaufman Award recipient is Dr. Mary Jane (Janie) Irwin of Pennsylvania State University. Dr. Irwin is the first woman to receive the Kaufman award, EDA's highest honor. As this morning's press release says: Dr. Irwin is ...
    • 1 Oct 2019
  • Breakfast Bytes: TSMC OIP: Process Status

    Paul McLellan
    Paul McLellan
    Last week was TSMC's Open Innovation Platform Innovation Forum (aka OIP). Dave Keller welcomed everyone and then introduced Cliff Hou who gave the update on everything technical. Here's what he said. Or rather, here's what I think he said...
    • 30 Sep 2019
  • Breakfast Bytes: Sunday Brunch Video for 29th September 2019

    Paul McLellan
    Paul McLellan
    https://youtu.be/zU_y5sQBlGA Made at TSMC OIP Symposium (camera Tom Hackett) Monday: CDNLive Israel 2019: Celsius, the Dead Sea, Ramallah Tuesday: Running the Software for an Embedded System Wednesday: Embedded Development: Specialized Proc...
    • 29 Sep 2019
  • System, PCB, & Package Design : BoardSurfers: PCB Electronics - Three Routing Challenges and Their Solutions

    mrigashira
    mrigashira
    Routing is the core of a PCB. And, it's not an easy task. There are many challenges but, thankfully, there are solutions too. Here we list three common challenges and explain how to solve them.
    • 27 Sep 2019
  • Analog/Custom Design: Virtuosity: Automated Device Placement and Routing—WSP-Based Tree Style Device Routing

    Sravasti
    Sravasti
    This blog provides an overview of the last step of the Virtuoso Automated Device Placement and Routing solution. In this blog, I'll talk about the key benefits of the Automated Device-Level Routing functionality.
    • 27 Sep 2019
  • PCB、IC封装:设计与仿真分析: Ken的博客系列之八 | 千兆位串行链路接口的SI方法

    Sigrity
    Sigrity
    作者:Ken Willis 上一篇:反向信道训练 自动合规性检查 有了详细的布局后互连以及IBIS-AMI模型的正确执行,您可以关注特定的、感兴趣的接口(本例中为PCI Express Gen 4)的合规性检查。 每个接口都有自己的特定标准。在这种情况下,PCI Express确定了许多眼图相关的时域标准、无源互连通道的频域标准以及满足特定抖动容限范围的能力。 单独评估这些标准可能会非常耗时,特别是,如果需要多次运行来扫描设计范围和多个通道模型的情形。用于通用串行链路标准的自动合规工具包通常会提...
    • 27 Sep 2019
  • Breakfast Bytes: Building Neural Networks with High-Level Synthesis

    Paul McLellan
    Paul McLellan
    Earlier this week, Dave Apte presented a webinar on AI Accelerator Design with Stratus High-Level Synthesis. It was timed for the East Coast and for Europe, so I had to get up at 6:00am to attend, but since I'm still somewhat jet-lagged from gett...
    • 27 Sep 2019
  • Breakfast Bytes: TSMC OIP: 6nm and 5nm

    Paul McLellan
    Paul McLellan
    Today it is TSMC's Open Innovation Platform Ecosystem Forum, or OIP for short. This is one of two events each year at which TSMC presents much of the status of their technology, their fab construction, and production schedules. The other is the T...
    • 26 Sep 2019
  • Breakfast Bytes: Embedded Development: Specialized Processing

    Paul McLellan
    Paul McLellan
    Yesterday, in Running the Program for an Embedded System, I wrote about using emulation and FPGA prototyping to test and debug the software load for an SoC. But I didn't discuss where the software came from, just that somehow there was some obje...
    • 25 Sep 2019
  • Whiteboard Wednesdays: Whiteboard Wednesdays - An Intuitive Introduction to Finite Element Analysis (FEA) for Electrical Engineers, Part 1

    References4U
    References4U

    In this week's Whiteboard Wednesdays video, Tom Hackett begins a 2-part introduction to finite element analysis (FEA) by looking at a simple model of a bridge and showing why FEA techniques are required for analysis of real-world structures. For a detailed explanation of the mathematics behind Finite Element Analysis, see this excellent video by Grasp Engineering:  Practical Introduction and Basics of Finite Element…

    • 24 Sep 2019
  • Breakfast Bytes: Running the Software for an Embedded System

    Paul McLellan
    Paul McLellan
    A big challenge with developing a modern SoC is developing the software. Not so much the development itself, which is not very different from any other software development, but running and debugging the software. Waiting for the silicon to...
    • 24 Sep 2019
  • System, PCB, & Package Design : IC Packagers: Finding Design Issues in SiP - Three Options for DRC Management During Sign Off

    Tyler
    Tyler
    Your design is complete. Yet, you have 20 DRC violations that need to be addressed (whether that means correcting the constraint required value, modifying objects, or waiving the DRC to sign off on it as okay). What’s the best way to go about r...
    • 24 Sep 2019
  • Analog/Custom Design: Virtuoso Meets Maxwell: Help With Electromagnetic Analysis—Part I

    Kabir
    Kabir
    This blog is the first one in the multi-part series that aims at providing some in-depth details of electromagnetic analysis in the Virtuoso RF solution. To learn about a few tips and tricks on the process setup, read
    • 23 Sep 2019
  • Breakfast Bytes: CDNLive Israel 2019: Celsius, the Dead Sea, Ramallah

    Paul McLellan
    Paul McLellan
    The big announcement at CDNLive Israel was during Anirudh's keynote when he announced the second product in the system analysis space, Celsius. This is a thermal solver using both finite element analysis (for the solid parts) and computation...
    • 23 Sep 2019
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