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Latest Blog Posts

  • System, PCB, & Package Design : IC Packagers: Routing Clean-Up Prior to Manufacturing

    Tyler
    Tyler
    A fantastic year is ending, so I want to take a quick opportunity to go over some of the lesser-known commands available to you for cleaning up and optimizing your routing for manufact...
    • 29 Dec 2019
  • System, PCB, & Package Design : IC Packagers: Guiding Your Team with Workflows

    Tyler
    Tyler
    The flow for efficiently and correctly designing a package substrate layout is a complex task. Many teams define steps to be followed by designers to make sure that rul...
    • 24 Dec 2019
  • Breakfast Bytes: Sunday Brunch Video for 22nd December 2019

    Paul McLellan
    Paul McLellan
    https://youtu.be/iEuzyt_6O_A Made in my living room (camera Carey Guo) Monday: The Most Important Operating System Ever Tuesday: What's Happening in RISC-V Land? Wednesday: System in Package? How to Plan and Build It Thursday: IEDM 2019...
    • 22 Dec 2019
  • PCB、IC封装:设计与仿真分析: 如何利用Allegro SiP Layout工具5步实现复杂引线框架封装的完整设计?

    TeamAllegro
    TeamAllegro
    文章翻译自Cadence博客“Designing a Complex Leadframe Package? See How SiP Layout Tool Can Cover All the Steps”。 space 随着技术的发展,引线框架封装设计变得越来越复杂。新材料和制造工艺的出现,使得封装中可以有更多有源和无源元件,同时新的接合能力扩展了可用引脚数量。 与此同时,信号完整性、电源完整性和温度完整性挑战也随之增加。以前可以在机械CAD工具中完成的简单设计,现在需要...
    • 20 Dec 2019
  • Academic Network: Cadence Co-organized the First EDA Competition to Help China Train More EDA Talent

    Tracy Zhu
    Tracy Zhu
    The first “China IC and EDA Design Elite Competition” started in June 2019 and received high attention and support from many universities. In total, there&nbs...
    • 20 Dec 2019
  • Breakfast Bytes: Off-Topic: 2019 TV Anniversaries

    Paul McLellan
    Paul McLellan
    It's the day before a holiday. Or in this case, ten days when Cadence will be shut down. As is traditional, I write about whatever I feel like, provided it has nothing to do with EDA or semiconductors. Today, some TV programs. This has been a big yea...
    • 20 Dec 2019
  • Digital Design: Library Characterization Tidbits: A Matrix for Your Reference

    Jommy
    Jommy
    When working on multiple tools of the Cadence Liberate Characterization Portfolio, do you tend to get confused about which commands or parameters are supported in a specific tool? Read more...
    • 19 Dec 2019
  • Breakfast Bytes: IEDM 2019: An Overview...Plus the Future of EUV

    Paul McLellan
    Paul McLellan
    IEDM, the International Electron Devices Meeting, took place last week. It was also the RISC-V Summit that week, so I missed most of Tuesday at IEDM since I went down to San Jose. My overview of the RISC-V Summit is in a post earlier in the week What...
    • 19 Dec 2019
  • Analog/Custom Design: Virtuosity: Looking Back at Virtuoso ADE Product Suite and Virtuoso Visualization and Analysis in 2019

    shubhangi upadhyay
    shubhangi upadhyay
    2019 was quite an eventful year for Virtuoso  ADE Product Suite and Virtuoso  Visualization and Analysis XL. We not only added new features such as Multi-Test Editor, but also redesigned existing forms to give you the best possible experience with the existing features.
    • 19 Dec 2019
  • Digital Design: 2019 Annual HLS Survey Results

    dpursley
    dpursley

    Each year, we survey the industry to get an idea of the industry’s experiences and expectations of high-level synthesis (HLS). As in last year’s survey, approximately half of the responses were from current HLS users, and half were from non-users. This year’s anonymous survey focused on productivity.

    Spoiler alert: Users find the HLS flow to be over 2.5x more productive for design and nearly 4x more…
    • 18 Dec 2019
  • Breakfast Bytes: System in Package? How to Plan and Build It

    Paul McLellan
    Paul McLellan
    This is a follow on to my previous two pieces about system-in-package (SiP) designs, System in Package, Why Now? Part 1 and Part 2. I'm going to use the term SiP generically just to mean any design with more than one die in the package. The focu...
    • 18 Dec 2019
  • System, PCB, & Package Design : BoardSurfers: Four Reasons to Use Allegro ECAD-MCAD Library Creator

    Sanjiv Bhatia
    Sanjiv Bhatia
    The Cadence  Allegro  ECAD-MCAD Library Creator helps you easily synchronize ECAD and MCAD libraries which in turn improves the quality and accuracy ....
    • 17 Dec 2019
  • System, PCB, & Package Design : IC Packagers: An Introduction to Allegro Package Designer Plus in 17.4

    Tyler
    Tyler
    Some of you are APD users, building single-chip or non-stacked multi-chip packages. Others of you are SiP Layout XL users, probably stacking dies or embedding elemen...
    • 17 Dec 2019
  • Breakfast Bytes: What's Happening in RISC-V Land?

    Paul McLellan
    Paul McLellan
    Last week was IEDM, the International Electronic Devices Meeting. I will write about that later this week, because last week was also the RISC-V Summit, which was originally scheduled for the week before in the Santa Clara Convention Center, but got ...
    • 17 Dec 2019
  • System, PCB, & Package Design : DATA Pulse: Speed up ECAD Part Search in Allegro System Capture

    Auromala
    Auromala
    Do you often search for parts when creating Allegro System Capture projects? Yes. Do you work with large ECAD libraries? Yes. Do you work with Allegro EDM Library Manager? No. Then this post is for you.
    • 16 Dec 2019
  • Breakfast Bytes: The Most Important Operating System Ever

    Paul McLellan
    Paul McLellan
    I wrote recently about Brian Kernighan's memoir and history in Brian Kernighan's Memoirs. He was at Bell Labs during the most important period for computer science, when the Unix operating system and the C programming language were creat...
    • 16 Dec 2019
  • Academic Network: 2019 Workshop on Electronic Design Automation in Hsinchu Taiwan

    Tracy Zhu
    Tracy Zhu
    The Cadence Academic Network has been supporting the Workshop on Electronic Design Automation (EDA) in Taiwan since 2016. This year the event was hosted by National Tsing Hua University in Hsinchu on December 7-8, 2019.   This year the workshop ...
    • 15 Dec 2019
  • PCB、IC封装:设计与仿真分析: 图文详解:如何在PowerSI中为封装体上添加假性球体和参考层?

    Sigrity
    Sigrity
    本文由Cadence经销商之一的北京耀华创芯电子科技有限公司整理撰写。耀创科技专注于电子设计自动化(EDA)服务,在引进国外先进EDA工具的同时,针对中国市场特殊性,与Cadence公司合作,在国内最早提出了电子设计与数据管理平台概念,开发出具有自主知识产权的电子电气设计集成数据管理平台,极大加速了板级产品的标准化设计流程,覆盖从优选元件选控、协同设计输入、在线检查分析、标准化文档输出及PLM/PDM系统集成,获得业界一致好评。同时提供除软件使用培训之外的项目陪同设计服务,“与客户共...
    • 13 Dec 2019
  • Breakfast Bytes: Known Good Die

    Paul McLellan
    Paul McLellan
    Do you know what known good die are? Do you know what wafer sort is? Final test? Wafer Sort After a wafer has been manufactured in the fab, it usually (but not always) goes through wafer sort. This uses a special tester to move across the w...
    • 13 Dec 2019
  • Breakfast Bytes: Brian Kernighan's Memoirs

    Paul McLellan
    Paul McLellan
    If you have ever worked on placement or floorplanning, and probably some other areas of EDA, then you will have heard of "Kernighan and Lin". It's a partitioning algorithm. You might not even have realized that the Kernighan of Kernigh...
    • 12 Dec 2019
  • Breakfast Bytes: System in Package, Why Now? Part 2

    Paul McLellan
    Paul McLellan
    This post is a continuation of last week's post Multiple Die in Packages. Why Now? That post looked at several of the drivers for system integration increasingly being done using 3D packaging technologies rather than integrating everything o...
    • 11 Dec 2019
  • Analog/Custom Design: Virtuoso IC6.1.8 ISR8 and ICADVM18.1 ISR8 Now Available

    Virtuoso Release Team
    Virtuoso Release Team
    The IC6.1.8 ISR8 and ICADVM18.1 ISR8 production releases are now available for download.
    • 11 Dec 2019
  • System, PCB, & Package Design : IC Packagers: Copy and Paste Refresh in 17.4

    Tyler
    Tyler
    The most common operations in any tool are probably adding, moving, deleting… plus copying and pasting. That we all are familiar with Control-C and Control-V being shortcuts to these actions speaks to their applicability across tools we use ev...
    • 10 Dec 2019
  • Breakfast Bytes: Cadence at CES 2020: Tensilica Everywhere

    Paul McLellan
    Paul McLellan
    Once again, Cadence will be at CES in Las Vegas. It takes place January 7 to 10, 2020, the start of a new decade. I wonder what electronic marvels we will see before 2030 rolls around. We will be in the south hall of the Las Vegas Convention Center (...
    • 10 Dec 2019
  • Analog/Custom Design: Virtuoso Meets Maxwell: Help with Electromagnetic Analysis - Part IV

    Kabir
    Kabir
    This is the fourth blog in the multi-part series that aims at providing in-depth details of electromagnetic analysis in the Virtuoso RF solution. This part highlights how EM analysis in Virtuoso is compared with other third-party tools in terms of accuracy, performance, capacity, memory consumption, and usability.
    • 9 Dec 2019
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