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Featured

Corporate News

The Three Phases of AI Adoption

Artificial intelligence is often discussed as if the industry is moving through a…

Corporate
Corporate 25 Jun 2026 • 6 min read
featured , infrastructure ai , agentic ai , physical ai , sciences ai

Corporate News

Finding What Truly Moves You: Honoring Alberto Sangiovanni-Vincentelli

"Finding what truly moves you is happiness. Success is measured in the lasting impact…

Corporate
Corporate 24 Jun 2026 • 2 min read
featured , EDA , Alberto Sangiovanni-Vincentelli , UC Berkeley

Corporate News

Accelerating Drug Discovery with Agentic AI and Computational Science

By Louis Culot, corporate vice president and general manager, Cadence Molecular Sciences…

Corporate
Corporate 23 Jun 2026 • 3 min read
drug discovery , Cadence Molecular Sciences , featured , agentic ai , NVIDIA

Corporate News

Honda + Cadence = Physical AI (part 2): Where Physical AI Will Be Won

Hello everyone, I'm Atsushi Ogawa, Center Head of HGR. The real challenge of physical…

Corporate
Corporate 22 Jun 2026 • 8 min read
featured , physical ai , HGR , AI , Honda
cdns - all_blogs_categories

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Blog - Post List
Latest blogs

Breakfast Bytes

"Alexa, What Is HiFi 5?"

"Alexa, turn on the living room light." "Okay." "Alexa, what is Cadence announcing…

Paul McLellan 31 Oct 2018 • 4 min read
hifi 5 , alexa , audio , voice recogntion , Tensilica

Whiteboard Wednesdays

Whiteboard Wednesdays – Machines with Voice UI and Tensilica HiFi 5 DSP

In this week’s Whiteboard Wednesdays video, Sachin Ghanekar talks about the new Tensilica…

References4U 31 Oct 2018 • less than a min read
Whiteboard Wednesdays , HiFi DSP , neural networks

Analog/Custom Design

Virtuosity: Is the Coloring Data Compliant with the MPT Flow?

In advanced node designs, to help you create designs that are compliant with the…

KomalJohar 31 Oct 2018 • 2 min read
Advanced Node , Multiple Patterning Technology , Virtuoso , Coloring Engine , Custom IC , Layout Editing

System, PCB, & Package Design 

How Do I Know What Functionality to Put on Which PCB Board?

There’s only so much you can do with a single printed circuit board (PCB). We’ve…

TeamAllegro 30 Oct 2018 • 4 min read
PCB , multi-board systems , multiboard PCB , PCB design , multiboard systems , Multi-board PCB , Allegro

Breakfast Bytes

Texas Instruments on Automotive Reliability

Recently, I seem to have been running into people from Texas Instruments (TI) talking…

Paul McLellan 30 Oct 2018 • 8 min read
Automotive , electromigration , functional safety , aging , Texas Instruments , fusa , reliability

Breakfast Bytes

Formal Signoff with JasperGold

At the recent Jasper User Group, I said that there were several themes. For overall…

Paul McLellan 29 Oct 2018 • 5 min read
Jasper User Group , JUG , formal , signoff , JasperGold

Breakfast Bytes

Sunday Brunch Video for 28th October 2018

https://youtu.be/1vU3sg3QlWc Coming from building 8 lab (camera Sean) Monday: The…

Paul McLellan 28 Oct 2018 • less than a min read
security , ARM Techcon , Jasper User Group , chiplets , formal , Jasper , 112g , SerDes , ARM , darpa , chips

PCB、IC封装:设计与仿真分析

升级到Allegro17.2-2016的10大理由之9:新设计规则检查

Allegro PCB 17.2-2016发行版增强了钻孔相关功能 我们为实际的钻孔工具、背钻工具、方形孔、沉头孔等增加了焊盘定义,并增加了钻孔容差。应广大用户需求…

TeamAllegro 26 Oct 2018 • less than a min read
PCB , Chinese blog , Allegro 17.2 , PCB设计 , 中文 , Allegro PCB Editor , Allegro PCB编辑器 , Allegro升级17.2 , Allegro

Breakfast Bytes

ERI: CHIPS and Chiplets

One of the DARPA programs that is part of the Electronic Resurgence Initiative (ERI…

Paul McLellan 26 Oct 2018 • 9 min read
chiplet , eri , darpa , chips

Verification

Cadence Announces Full Cadence Verification Suite Compatibility for Arm-Based High…

On October 16, 2018, Cadence Design Systems, Inc announced that, through a wide-reaching…

XTeam 25 Oct 2018 • 1 min read
press release , HPC , ARM , announcement

Analog/Custom Design

Virtuosity: Updated ADE Assembler and ADE Explorer Rapid Adoption Kit

The Virtuoso ADE Assembler and Virtuoso ADE Explorer Rapid Adoption Kit (RAK) has…

Arja H 25 Oct 2018 • 3 min read
ADE Explorer , Setup Library , Rapid Adoption Kit , Run Plan , ADE Verifier , IC6.1.8 , VVO , ADE Assembler

The India Circuit

An Ocean Of Opportunity

We were lucky to have Cadence CEO Lip-Bu Tan visit India recently, when he keynoted…

Madhavi Rao 25 Oct 2018 • 2 min read
artificial intelligence , CDNLive India , CDNLive , data driven economy , machine learning , Lip-Bu Tan , AI

Breakfast Bytes

Formal Post-Silicon Debug

Two outstanding presentations at the recent Jasper User Group were on using JasperGold…

Paul McLellan 25 Oct 2018 • 6 min read
Jasper User Group , JUG , JasperGold

Whiteboard Wednesdays

Whiteboard Wednesdays - Cadence Unveils 112G Long-Reach SerDes IP in 7nm Technol…

With hyperscale datacenters requiring network switches delivering bandwidths of 12…

References4U 24 Oct 2018 • less than a min read
Whiteboard Wednesdays , 100G Ethernet , 112G SerDes , PAM-4 , 400G Ethernet , 800G Ethernet

Breakfast Bytes

ERI: Hardware Security Workshop

The opening morning of DARPA's Electronic Resurgence Initiative summit in San Francisco…

Paul McLellan 24 Oct 2018 • 8 min read
security , eri , darpa

System, PCB, & Package Design 

How To Maintain Connectivity in a Multi-Board PCB System

Today’s electronics often incorporate multiple interconnected printed circuit boards…

TeamAllegro 23 Oct 2018 • 4 min read
PCB SI , PCB , multiboard PCB , PCB Signal integrity , PCB design , multiboard pcb system , multiboard systems

Breakfast Bytes

Arm TechCon: Get Ready for the NEOVERSE

I don't know if it was the vibe Arm's marketing was going for, but if you wanted…

Paul McLellan 23 Oct 2018 • 5 min read
ARM Techcon , softbank , arm neoverse , ARM

Breakfast Bytes

The World's First Working 7nm 112G Long Reach SerDes Silicon

At the start of November last year, Cadence announced that it was acquiring nusemi…

Paul McLellan 22 Oct 2018 • 6 min read
pam4 , 112g , semiconductor IP , SerDes , 7nm , datacenter

PCB、IC封装:设计与仿真分析

升级到Allegro17.2-2016的10大理由之8:过孔结构——下一代高速布线解决方案

过孔转换对信号布线来说十分常见。在高速设计中过孔转换是造成PCB互连中信号衰减的主要原因。而且高速通道需要地孔临近关键信号,在信号走线换层时,提供连续的回流路径…

TeamAllegro 19 Oct 2018 • less than a min read
PCB , SI , Chinese blog , Allegro 17.2 , PCB设计 , 差分对支持 , 中文 , 信号完整性 , Allegro升级17.2 , SI分析与建模 , 高速 , 差分对
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