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Latest Blog Posts

  • PCB、IC封装:设计与仿真分析: Ken的博客系列之七 | 千兆位串行链路接口的SI方法

    Sigrity
    Sigrity
    作者:Ken Willis 上一篇:使用IBIS-AMI模型进行仿真 反向信道训练 均衡器自适应的另一项能力是反馈训练。许多高速串行协议规定SerDes接收器可以评估发射器送出的training patterns的信号质量,以此来决定发射器均衡的大小,然后将这个要求反馈给发射器,然后评估下一个training pattern。这个过程会重复多次,直到接收器对发射器的设置满意,那么这个满意的设置就会被实际传输出去。 图1:反向信道训练(点击查看大图) 尽管目前的IBIS标准还不支持反馈训练功能,...
    • 19 Sep 2019
  • Breakfast Bytes: Programming Languages for Embedded Systems

    Paul McLellan
    Paul McLellan
    How do you program an embedded system? Say, the code that runs on the control processor on a big SoC? What programming language should you use? I have never really programmed an embedded system, unless you count writing a couple of experimental progr...
    • 19 Sep 2019
  • Academic Network: Xidian University: 2019 Student Summer Training Camp

    Tracy Zhu
    Tracy Zhu
    School of Microelectronics of Xidian University, was set up in 2004 which is one of the National Instruction Bases for Integrated Circuit Talents approved by the Ministry of Education of China, has been hosting a Student Summer Training Camp for 5 ye...
    • 18 Sep 2019
  • Breakfast Bytes: Celsius: Thermal and Electrical Analysis Together at Last

    Paul McLellan
    Paul McLellan
    Today at CDNLive Israel, Anirudh Devgan, Cadence's President, announced the Celsius Thermal Solver. This is Cadence's second product in the system analysis space, following on from the Clarity 3D Solver, announced at CDNLive Silicon Valley ea...
    • 18 Sep 2019
  • Academic Network: Taiwan National IC Design Competition

    Tracy Zhu
    Tracy Zhu
    The Taiwan National IC Design Competition was a great opportunity for Cadence and the Academic Network to build our brand with students, connect with academia and attract top talent. This was the second year that we sponsored the ...
    • 17 Sep 2019
  • Whiteboard Wednesdays: Whiteboard Wednesdays - Announcing Celsius Thermal Solver: A New Approach to System-Level Thermal Analysis

    References4U
    References4U

    In this week's Whiteboard Wednesdays video, Be Gu introduces Celsius Thermal Solver, a new tool employing finite element analysis (FEA) techniques for thermal analysis of electronic systems. Ben explains how a novel architecture enables Celsius to deliver 10x capacity and performance improvements over existing solutions.

    https://youtu.be/JrQbCZe9e8c

    • 17 Sep 2019
  • System, PCB, & Package Design : BoardSurfers: PCB Electronics - Defining and Applying Physical and Spacing Constraints

    mrigashira
    mrigashira
    If you get frequent calls from your fab houses or your customers regarding your product, or if your schematic, layout, and packaging engineers spend a lot of time exchanging notes about their requirements not being met, resulting in back and forth of designs, or if you believe, like most of us do, that a product should do what it was designed to do, constraints are your friends.
    • 17 Sep 2019
  • Digital Design: Upcoming Webinar: AI Accelerator Design with Stratus HLS

    dpursley
    dpursley

    There is no doubt that 2019 has seen an explosion of artificial intelligence/machine learning usage for Stratus HLS. In fact, this momentum started in 2017.

    Noting the increase in machine learning applications in our user base, we researched how to efficiently move from a TensorFlow model to hardware via Stratus HLS. By July 2018, AI startup Syntiant was talking at DAC about how they went from spec to tapeout in six …

    • 17 Sep 2019
  • Breakfast Bytes: PCIe Gen 4: It's Official, We're Compliant

    Paul McLellan
    Paul McLellan
    Way back in April 2016, I wrote a post about Cadence IP for PCI Express (PCIe) Gen4 where we demonstrated compliance with Mellanox (now part of NVIDIA). As Mellanox's Gilad Shainer said to me when I talked to him back then: interoperability...
    • 17 Sep 2019
  • System, PCB, & Package Design : IC Packagers: Capture Your Design for Review

    Tyler
    Tyler
    How do you quickly show another developer an issue that concerns you? Do you need to send them the entire design, start a screen sharing session, or bring up the Symphony server and allow them to connect? All of these are GREAT review mechanisms; however, they aren’t always viable or convenient.
    • 17 Sep 2019
  • Academic Network: Academic Network Engaging with National Taiwan University

    Tracy Zhu
    Tracy Zhu
    The National Taiwan University hosted an EDA summer camp for the third consecutive year! Since “EDA" is an unfamiliar concept for many students, the Graduate Institute of Electronics Engineering National Taiwan University (NTU GIEE) and&nb...
    • 16 Sep 2019
  • Breakfast Bytes: MLPerf: Benchmarking Machine Learning

    Paul McLellan
    Paul McLellan
    Most presentations at the recent HOT CHIPS conference are about actual chips, mostly processors of one kind or another. But in machine learning, there is a need to be able to compare these processors. This is where MLPerf comes in, putting together a...
    • 16 Sep 2019
  • Analog/Custom Design: Virtuosity: Layout Reuse Flow in Modgen

    Aneesh Shastry
    Aneesh Shastry
    Modgen now supports the Layout Reuse Flow. Read on to see how you can use this feature to boost your layout productivity by reducing the time and effort to create Modgen.
    • 15 Sep 2019
  • System, PCB, & Package Design : DATA Pulse: Track Your Components—Efficient Library and Design Data Management

    Auromala
    Auromala

     Ever noticed how some objects always mysteriously disappear? It's like they have their own legs. Or maybe, secretly, they thirst for adventure and go wandering off. Socks for example. Why does one twin always disappear after a round in the washing machine? After a few months, you just have a sad pile of lonely, orphaned socks in a variety of colors. Pens are equally guilty. They're always disappearing. Pen caps are even…

    • 15 Sep 2019
  • Breakfast Bytes: Sunday Brunch Video for 15th September 2019

    Paul McLellan
    Paul McLellan
    https://youtu.be/bcAO52jxk10 Made at SFO (camera Carey Guo) Monday: HOT CHIPS: In-DRAM Compute Tuesday: CDNLive India 2019: NXP and More Wednesday: EDPS Preview 2019 Thursday: Intelligent Systems Friday: Intelligent System Design www.breakf...
    • 15 Sep 2019
  • PCB、IC封装:设计与仿真分析: Ken的博客系列之六 | 千兆位串行链路接口的SI方法

    Sigrity
    Sigrity
    作者:Ken Willis 上一篇:高效的互连提取 使用IBIS-AMI模型进行仿真 此时,SerDes元器件供应商应该已经提供了所需的IBIS-AMI模型,如果这些模型可用,那么替换仿真测试平台中的对应模型。现在,我们重点关注后仿真的验证工作。在仿真测试平台中替换为你自己的模型,尽管这时看起来你好像就马上可以进行仿真工作了,但是对于IBIS-AMI模型仍然有许多工作需要做。 如前所述,算法部分或者IBIS-AMI模型的“AMI”部分为SerDes的均衡功能。在双沿数据速...
    • 13 Sep 2019
  • Breakfast Bytes: Intelligent System Design

    Paul McLellan
    Paul McLellan
    Yesterday in my post Intelligent Systems, I wrote about how the imperative for differentiated products, especially at the high end of markets, is pushing both system and semiconductor companies to take a more holistic view of system design. Cadence c...
    • 13 Sep 2019
  • Breakfast Bytes: Intelligent Systems

    Paul McLellan
    Paul McLellan
    Cadence's goal is to empower engineers at semiconductor and systems companies to create innovative, intelligent, and highly differentiated electronic products that transform the way people live, work, and play. One big change is for system companies ...
    • 12 Sep 2019
  • Digital Design: Safety and Aging in IoT Devices: What We Know Today

    XTeam
    XTeam
    How do we achieve highly accurate aging data models for critical circuits in automotive or IoT applications? IoT device aging isn’t well understood yet, since most of it is still so new. How will the software stand up against tomorrow’s t...
    • 11 Sep 2019
  • 定制IC芯片设计 : Virtuosity: Spring-Cleaned Virtuoso Doc Closet

    Rishu Misri Jaggi
    Rishu Misri Jaggi
    如需了解IC6.1.8 和ICADVM18.1相关的最新文档,请继续阅读.
    • 11 Sep 2019
  • Breakfast Bytes: EDPS Preview 2019

    Paul McLellan
    Paul McLellan
    EDPS, the Electronic Design Process Symposium, is coming up next Monday. It will be on Thursday, October 3 and Friday, October 4. Once again it will be held at SEMI's offices in Milpitas. I think of it as Gary Smith's conference, since he was al...
    • 11 Sep 2019
  • Life at Cadence: How to Land a Job at Cadence: Recruiters Share Their Best Tips for Standing Out and Getting an Interview

    Ashley Sneathen
    Ashley Sneathen
    As we send off the last of our 2019 Summer Interns (read more about their experience here) and say goodbye to summer, our recruiting team is already turning their attention to finding the next group of college hires and interns to join the Cadence te...
    • 10 Sep 2019
  • System, PCB, & Package Design : IC Packagers: How Far Away are You?

    Tyler
    Tyler
    Layout design is all about clearances. Daily challenges come from maintaining consistent space between your differential pair members, calculating the number of routing channels you can squeeze between two vias, or ensuring adequate clearance of bond...
    • 10 Sep 2019
  • System, PCB, & Package Design : BoardSurfers: PCB Electronics - Electrical Constraints

    mrigashira
    mrigashira
    Whether it's NASA's space missions or a school camping trip; building a cutting-edge, reusable rocket system or baking a simple lemon tart - planning is a must to avoid disasters, or at least to get a predictable output. So is the case with PCBs. You want to plan ahead to avoid design mistakes that can cost you money and time. And that's where constraints come handy.
    • 10 Sep 2019
  • Analog/Custom Design: Virtuoso IC6.1.8 ISR6 and ICADVM18.1 ISR6 Now Available

    Virtuoso Release Team
    Virtuoso Release Team
    The IC6.1.8 ISR6 and ICADVM18.1 ISR6 production releases are now available for download.
    • 10 Sep 2019
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