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Spotlight Taiwan: Cadence AWR 電磁與熱分析功能實現完整RF 應用

candyyu

【技術講堂影片回顧】為取得競爭激烈的5G/無線市場先機，RF技術成為兵家必爭之地，為協助客戶實現完整且全面的RF工作流程解決方案，Cadence打造RF工作流程創新，導入RF整合為工程團隊提升生產力。本次線上研討會影片回顧，將帶您一窺Cadence Clarity 3D 求解器(Solver) 和Celsius 熱求解器(Thermal Solver) 無縫整合導入Cadence AWR環境平台，透過內建的電磁與熱分析，不受限制的直接從內部解決大規模且複雜的RF系統，幫助客戶減少周...
- 28 Nov 2022
Analog/Custom Design: Virtuosity: Custom IC Design Flow/Methodology - Post-Layout Circuit Simulation and GDSII Generation

Ashish Patni

Read this blog for getting an overview of post-layout circuit simulation & GDSII generation.
- 23 Nov 2022
Life at Cadence: System Verification of Arm Neoverse V2-Based SoCs

Corporate

The world around us has become data-centric; everything needs data, from navigation maps in vehicles to medical chatbots to autonomous cars. We are using data to solve complex problems and decision-making. The beauty is more data leads to better per...
- 22 Nov 2022
Digital Design: Voltus Voice: Voltus-Sigrity Collaboration Fuels System Innovation

Anshika Gahlaut

Learn how the Voltus-Sigrity X integrated solution can help you achieve faster system-level power integrity analysis and closure.
- 21 Nov 2022
Life at Cadence: Cadence Optimality AI Removes Simulation’s Biggest Bottleneck: Humans

Ben Gu

A core part of what we do at Cadence comes from an inescapable truth: designing and fabricating a silicon chip is an increasingly complex, time-consuming, and therefore expensive process. At every step of that process there are decisions to be made....
- 21 Nov 2022
RF /マイクロ波設計: μWaveRiders:最新の AWR Design Environment オプティマイザでゴールを決める

RF Design Japan

The Team RF "μWaveRiders" ブログシリーズはCadence AWR RF製品のためのショーケースです。月ごとの話題は、Cadence AWR Design Environmentのリリースのハイライト、機能ビデオとスポットライト、ソフトウェアのヒント、コツ、カスタマイズによって異なります。最新のμWaveRidersのブログ投稿についてのメール通知を受け取りたい方はSubscribe をして下さい。 AWR Design Env...
- 21 Nov 2022
Verification: How to Verify Complex PIPE Interface Based PHY Designs?

Nehal Patel

High-end SOC architectures today requiring more area and higher speed to transfer and process data. To fulfill this requirement, protocol such as PCIe, USB, DP, SATA and USB4 are regularly being updated. Most critical part of the high-speed interface is the Physical (PHY) layer of the protocol where the actual signaling happens. In addition to signaling, the PHY also takes care of some of the processing to reduce errors…
- 21 Nov 2022
RF Engineering: μWaveRiders: Scoring Goals with the Latest AWR Design Environment Optimizer

TeamAWR

AWR V22.1 software introduces the Pointer-Hybrid optimization method which uses a combination of optimization methods, switching back and forth between methods to efficiently find the lowest optimization error function cost. The optimization algorithm automatically determines when to switch to a different optimization method, making this a superior method over manual selection of algorithms. This method is particularly…
- 21 Nov 2022
Breakfast Bytes: Sunday Brunch Video for 20th November 2022

Paul McLellan

https://youtu.be/gLQbSlICCaE Made in Munich Englischergarten (camera Carey) Monday: Tensilica for Automotive Radar Tuesday: Passage: Wafer-Scale Programmable Photonic Communication Wednesday: Software 2.0 Thursday: Offtopic: Old Programming Languages...
- 20 Nov 2022
System, PCB, & Package Design : IC Packagers: Training Insights: What's New in the Allegro X Advanced Package Designer Course

DanGerard

The Allegro X Advanced Package Designer course provides all the essential training required to start working with Allegro X Advanced Package Designer. The course covers all the design tasks, including importing IC data, BGA generation and connec...
- 18 Nov 2022
Verification: How Renesas Reduced Automotive SoC Verification Time

Reela Samuel

The automotive world is conquering new technological heights, piggybacking on advanced semiconductor components. A typical vehicle has around 1,400 semiconductor components, and the numbers are expected to go higher as vehicles become more intelligent and autonomous. The ecosystem change in the automotive world has mutated the demand patterns for automotive chips, resulting in the growing demand for purpose-driven applications…
- 17 Nov 2022
Life at Cadence: Cardo Brings Cutting-Edge Audio Connectivity to Groups in Motion

Corporate

Motorcyclists riding through extreme conditions need a communication device that’s as rugged as the road ahead of them. That’s where Cardo Systems comes in, with their tough, dependable, and durable communicators. Most of all, their commu...
- 17 Nov 2022
Breakfast Bytes: Old Programming Languages

Paul McLellan

This is the last day before a break. Tomorrow I fly to Germany for CadenceLIVE Europe, and I will be taking a week of vacation after that to visit Berlin, a city I've somehow never visited. Breakfast Bytes will next appear on November 30th. As us...
- 17 Nov 2022
Breakfast Bytes: Software 2.0

Paul McLellan

I recently came across the idea of "software 2.0". I was watching a Lex Fridman interview with Andrej Karpathy called Andrej Karpathy: Tesla AI, Self-Driving, Optimus, Aliens, and AGI | Lex Fridman Podcast #333. I'll embed the podcast a...
- 16 Nov 2022
Life at Cadence: Effective Measurement Is the Key to Meeting Environmental Sustainability Goals in Data Centers

Neil Zaman

Hyperscale compute, using high-performance connected processors, continually transforms our lives as more and more applications rely on this type of compute, and at the heart of this hyperscale revolution are data centers. It is estimated that an eq...
- 15 Nov 2022
Breakfast Bytes: Passage: Wafer-Scale Programmable Photonic Communication

Paul McLellan

One of the most intriguing chips presented at HOT CHIPS earlier this summer was Lightmatter's Passage. I covered it briefly in my summary post about the conference HOT CHIPS Day 1: Hot Chiplets. Steve Klinger, Lightmatter's VP of product, presented a...
- 15 Nov 2022
Data Center: Cadence Enhances Data Center Digital Twins with NVIDIA Omniverse

Corporate

Companies across all industries are beginning to harness the power of simulation to develop new products, enhance customer experience, and unlock operational efficiencies. Digital twins, connected models and simulations of industrial assets, process...
- 14 Nov 2022
Life at Cadence: Mobilizing the Impact of Our "One Team" Culture

Michelle Hoffmann

Since 2018, Cadence has partnered with Team4Tech to make a mark on the world by connecting employees' business knowledge and tech skills with select non-profit partners in underserved communities. This program has been an incredible way for ...
- 14 Nov 2022
Computational Fluid Dynamics: Last Week at Fidelity CFD

John Chawner

Merry Monday, and welcome to another look back at what we've been up to at Fidelity CFD over the past two weeks. From the Blogs Cadence Welcomes Cascade Technologies Cadence welcomes Cascade Technologies, an innovator in the field of computation...
- 14 Nov 2022
Breakfast Bytes: Tensilica for Automotive Radar

Paul McLellan

At the recent Linley Fall Processor Conference, Cadence's David Bell presented Tailored Automotive Radar Processing with Tensilica ConnX DSPs. There are four primary types of sensors that can be used in automotive applications: cameras, lidar, r...
- 14 Nov 2022
System, PCB, & Package Design : ASCENT: Synchronizing Schematic and Layout Designs

Auromala

To successfully develop and maintain designs, you need some way to track changes to a schematic and layout to determine which version of a logic design was loaded into your PCB. In an Allegro® Pulse-managed environment, you can easily s...
- 11 Nov 2022
Life at Cadence: Michigan Electric Boat Is Propelling the Naval Industry

Corporate

The University of Michigan Electric Boat (UM-EB) is a student team that’s designing the next generation of the naval industry. They’re designing, building, and racing electric boats to compete on a national stage, and they’ve commit...
- 10 Nov 2022
Academic Network: Introducing DATE 2023 Young People Programme

Anton Klotz

The DATE conference, the biggest EDA conference in Europe will be held April 17-19 2023, in Antwerp, Belgium. After three years of a virtual conference, the European and international EDA and microelectronic design communities will finally get t...
- 10 Nov 2022
Breakfast Bytes: Linley: Enabling Heterogeneous Integration of Chiplets Through Advanced Packaging with AMD/Xilinx

Paul McLellan

At the recent Linley Fall Processor Conference, the first day wrapped up with a presentation by Ivor Barber of AMD, where he is the Corporate VP of Packaging. He started with an introduction to chiplets which I will skip. In fact, I think he ran thro...
- 10 Nov 2022
Computational Fluid Dynamics: FEA or CFD for a Better Thermal Solution Accuracy?

Veena Parthan

There are multiple instances when FEA tools are compared with CFD. Although both tools can solve thermal problems, there is a difference in the solution accuracy while solving different physics.
- 10 Nov 2022

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