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Latest Blog Posts

  • Whiteboard Wednesdays: Whiteboard Wednesdays - An Intuitive Introduction to Finite Element Analysis (FEA) for Electrical Engineers, Part 1

    References4U
    References4U

    In this week's Whiteboard Wednesdays video, Tom Hackett begins a 2-part introduction to finite element analysis (FEA) by looking at a simple model of a bridge and showing why FEA techniques are required for analysis of real-world structures. For a detailed explanation of the mathematics behind Finite Element Analysis, see this excellent video by Grasp Engineering:  Practical Introduction and Basics of Finite Element…

    • 24 Sep 2019
  • Breakfast Bytes: Running the Software for an Embedded System

    Paul McLellan
    Paul McLellan
    A big challenge with developing a modern SoC is developing the software. Not so much the development itself, which is not very different from any other software development, but running and debugging the software. Waiting for the silicon to...
    • 24 Sep 2019
  • System, PCB, & Package Design : IC Packagers: Finding Design Issues in SiP - Three Options for DRC Management During Sign Off

    Tyler
    Tyler
    Your design is complete. Yet, you have 20 DRC violations that need to be addressed (whether that means correcting the constraint required value, modifying objects, or waiving the DRC to sign off on it as okay). What’s the best way to go about r...
    • 24 Sep 2019
  • Analog/Custom Design: Virtuoso Meets Maxwell: Help With Electromagnetic Analysis—Part I

    Kabir
    Kabir
    This blog is the first one in the multi-part series that aims at providing some in-depth details of electromagnetic analysis in the Virtuoso RF solution. To learn about a few tips and tricks on the process setup, read
    • 23 Sep 2019
  • Breakfast Bytes: CDNLive Israel 2019: Celsius, the Dead Sea, Ramallah

    Paul McLellan
    Paul McLellan
    The big announcement at CDNLive Israel was during Anirudh's keynote when he announced the second product in the system analysis space, Celsius. This is a thermal solver using both finite element analysis (for the solid parts) and computation...
    • 23 Sep 2019
  • Breakfast Bytes: Sunday Brunch Video for 22nd September 2019

    Paul McLellan
    Paul McLellan
    https://youtu.be/6p94sN1fHFY Made at Tel Aviv seafront (camera Carey Guo) Monday: MLPerf: Benchmarking Machine Learning Tuesday: PCIe Gen 4: It's Official, We're Compliant Wednesday: Celsius: Thermal and Electrical Analysis Together...
    • 21 Sep 2019
  • Breakfast Bytes: 500th Anniversary of Magellan's Voyage

    Paul McLellan
    Paul McLellan
    Earlier this year, on July 20, we celebrated the 50th anniversary of the first landing on the moon. I wrote about it—well, mostly about the Apollo Guidance Computer—that day in my post The First Computer on the Moon. Increasingly, getting...
    • 20 Sep 2019
  • Analog/Custom Design: Virtuosity: Automated Device Placement and Routing—Base Layer Fill Insertion

    Sravasti
    Sravasti
    Welcome back to my next post in the Virtuoso Automated Device Placement and Routing blog series. At advanced node, after running the placer, there are a few additional requirements for base layers to be taken care of before the layout is routed and taken to completion. In this blog post, I’ll talk about how adding device fills helps meet these requirements. Read the post to know more.
    • 19 Sep 2019
  • Academic Network: CDNLive Taiwan – Cadence User Conference 2019

    Tracy Zhu
    Tracy Zhu
    CDNLive Cadence User Conference is an opportunity for Cadence technology users, developers, industry experts, and academia to come together to network, share best practices on critical design and verification issues, and discover new t...
    • 19 Sep 2019
  • The India Circuit: The Safety and Security of Autonomous Vehicle Systems

    Madhavi Rao
    Madhavi Rao
    At the recently-held CDNLive India 2019, Cadence’s annual user conference, we had a session by Cadence’s partners Green Hills Software. Green Hills Software is the worldwide leader in embedded safety and security. Cadence and Green Hills ...
    • 19 Sep 2019
  • PCB、IC封装:设计与仿真分析: Ken的博客系列之七 | 千兆位串行链路接口的SI方法

    Sigrity
    Sigrity
    作者:Ken Willis 上一篇:使用IBIS-AMI模型进行仿真 反向信道训练 均衡器自适应的另一项能力是反馈训练。许多高速串行协议规定SerDes接收器可以评估发射器送出的training patterns的信号质量,以此来决定发射器均衡的大小,然后将这个要求反馈给发射器,然后评估下一个training pattern。这个过程会重复多次,直到接收器对发射器的设置满意,那么这个满意的设置就会被实际传输出去。 图1:反向信道训练(点击查看大图) 尽管目前的IBIS标准还不支持反馈训练功能,...
    • 19 Sep 2019
  • Breakfast Bytes: Programming Languages for Embedded Systems

    Paul McLellan
    Paul McLellan
    How do you program an embedded system? Say, the code that runs on the control processor on a big SoC? What programming language should you use? I have never really programmed an embedded system, unless you count writing a couple of experimental progr...
    • 19 Sep 2019
  • Academic Network: Xidian University: 2019 Student Summer Training Camp

    Tracy Zhu
    Tracy Zhu
    School of Microelectronics of Xidian University, was set up in 2004 which is one of the National Instruction Bases for Integrated Circuit Talents approved by the Ministry of Education of China, has been hosting a Student Summer Training Camp for 5 ye...
    • 18 Sep 2019
  • Breakfast Bytes: Celsius: Thermal and Electrical Analysis Together at Last

    Paul McLellan
    Paul McLellan
    Today at CDNLive Israel, Anirudh Devgan, Cadence's President, announced the Celsius Thermal Solver. This is Cadence's second product in the system analysis space, following on from the Clarity 3D Solver, announced at CDNLive Silicon Valley ea...
    • 18 Sep 2019
  • Academic Network: Taiwan National IC Design Competition

    Tracy Zhu
    Tracy Zhu
    The Taiwan National IC Design Competition was a great opportunity for Cadence and the Academic Network to build our brand with students, connect with academia and attract top talent. This was the second year that we sponsored the ...
    • 17 Sep 2019
  • Whiteboard Wednesdays: Whiteboard Wednesdays - Announcing Celsius Thermal Solver: A New Approach to System-Level Thermal Analysis

    References4U
    References4U

    In this week's Whiteboard Wednesdays video, Be Gu introduces Celsius Thermal Solver, a new tool employing finite element analysis (FEA) techniques for thermal analysis of electronic systems. Ben explains how a novel architecture enables Celsius to deliver 10x capacity and performance improvements over existing solutions.

    https://youtu.be/JrQbCZe9e8c

    • 17 Sep 2019
  • System, PCB, & Package Design : BoardSurfers: PCB Electronics - Defining and Applying Physical and Spacing Constraints

    mrigashira
    mrigashira
    If you get frequent calls from your fab houses or your customers regarding your product, or if your schematic, layout, and packaging engineers spend a lot of time exchanging notes about their requirements not being met, resulting in back and forth of designs, or if you believe, like most of us do, that a product should do what it was designed to do, constraints are your friends.
    • 17 Sep 2019
  • Digital Design: Upcoming Webinar: AI Accelerator Design with Stratus HLS

    dpursley
    dpursley

    There is no doubt that 2019 has seen an explosion of artificial intelligence/machine learning usage for Stratus HLS. In fact, this momentum started in 2017.

    Noting the increase in machine learning applications in our user base, we researched how to efficiently move from a TensorFlow model to hardware via Stratus HLS. By July 2018, AI startup Syntiant was talking at DAC about how they went from spec to tapeout in six …

    • 17 Sep 2019
  • Breakfast Bytes: PCIe Gen 4: It's Official, We're Compliant

    Paul McLellan
    Paul McLellan
    Way back in April 2016, I wrote a post about Cadence IP for PCI Express (PCIe) Gen4 where we demonstrated compliance with Mellanox (now part of NVIDIA). As Mellanox's Gilad Shainer said to me when I talked to him back then: interoperability...
    • 17 Sep 2019
  • System, PCB, & Package Design : IC Packagers: Capture Your Design for Review

    Tyler
    Tyler
    How do you quickly show another developer an issue that concerns you? Do you need to send them the entire design, start a screen sharing session, or bring up the Symphony server and allow them to connect? All of these are GREAT review mechanisms; however, they aren’t always viable or convenient.
    • 17 Sep 2019
  • Academic Network: Academic Network Engaging with National Taiwan University

    Tracy Zhu
    Tracy Zhu
    The National Taiwan University hosted an EDA summer camp for the third consecutive year! Since “EDA" is an unfamiliar concept for many students, the Graduate Institute of Electronics Engineering National Taiwan University (NTU GIEE) and&nb...
    • 16 Sep 2019
  • Breakfast Bytes: MLPerf: Benchmarking Machine Learning

    Paul McLellan
    Paul McLellan
    Most presentations at the recent HOT CHIPS conference are about actual chips, mostly processors of one kind or another. But in machine learning, there is a need to be able to compare these processors. This is where MLPerf comes in, putting together a...
    • 16 Sep 2019
  • Analog/Custom Design: Virtuosity: Layout Reuse Flow in Modgen

    Aneesh Shastry
    Aneesh Shastry
    Modgen now supports the Layout Reuse Flow. Read on to see how you can use this feature to boost your layout productivity by reducing the time and effort to create Modgen.
    • 15 Sep 2019
  • System, PCB, & Package Design : DATA Pulse: Track Your Components—Efficient Library and Design Data Management

    Auromala
    Auromala

     Ever noticed how some objects always mysteriously disappear? It's like they have their own legs. Or maybe, secretly, they thirst for adventure and go wandering off. Socks for example. Why does one twin always disappear after a round in the washing machine? After a few months, you just have a sad pile of lonely, orphaned socks in a variety of colors. Pens are equally guilty. They're always disappearing. Pen caps are even…

    • 15 Sep 2019
  • Breakfast Bytes: Sunday Brunch Video for 15th September 2019

    Paul McLellan
    Paul McLellan
    https://youtu.be/bcAO52jxk10 Made at SFO (camera Carey Guo) Monday: HOT CHIPS: In-DRAM Compute Tuesday: CDNLive India 2019: NXP and More Wednesday: EDPS Preview 2019 Thursday: Intelligent Systems Friday: Intelligent System Design www.breakf...
    • 15 Sep 2019
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