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Latest Blog Posts

  • Breakfast Bytes: 5G in 2020

    Paul McLellan
    Paul McLellan
    There is a famous quote, attributed to Mark Twain but more likely said by his friend Charles Dudley Warner: Everybody talks about the weather but nobody does anything about it. I think that 5G in 2020 is going to be like that. You will hear lots of...
    • 15 Jan 2020
  • System, PCB, & Package Design : BoardSurfers: DFF - Three Steps to Perfect Mask Defined Padstacks in Your PCB

    mrigashira
    mrigashira
    We will of course not venture into the finer points of the debate about mask-defined pins (SMD) and metal-defined pins (NSMD) but assume that for whatever reasons, we have mask-defined pins in our design and we want our design to be to be fabricated correctly and as....
    • 14 Jan 2020
  • System, PCB, & Package Design : IC Packagers: The Default Bond Wire Profile - PROFILE1 (And Three Reasons Why Not to Use It)

    Tyler
    Tyler
    For those of you who do wire-bond package substrate – whether you’re designing a single-chip leadframe, a multi-die memory stack, or a complex stack with wire-bonds, flip-chips, interposers, and spacers all in one – you need wire pr...
    • 14 Jan 2020
  • Breakfast Bytes: Mark Cuban on Media and AI

    Paul McLellan
    Paul McLellan
    At CES there was a session in which Mark Cuban was interviewed. As he pointed out, he used to be most famous for being an entrepreneur, and then it was because he was the owner of the Mavericks basketball team, and now it is mostly his appearances on...
    • 14 Jan 2020
  • 定制IC芯片设计 : Virtuosity: 针对高阶工艺节点的器件级布线工具— 树型布线流程

    Parula
    Parula
    本博客是Virtuoso器件级布线系列博客的最终篇,将介绍树干和树枝形成树的完整过程,通过这种类比方式,便于用户全面了解Tree Route 的流程及其功能.   前文回顾 在进入本篇博客前,让我们回顾下之前的相关博客:
    • 13 Jan 2020
  • Breakfast Bytes: Details of TSMC's IEDM Presentation on N5

    Paul McLellan
    Paul McLellan
    At IEDM in December, one of the papers in the very last session (a sneaky trick to get us all to stay) was TSMC announcing their 5nm process. The paper actually had the cumbersome title 5nm CMOS Production Technology Platform Featuring Full-Fled...
    • 13 Jan 2020
  • Breakfast Bytes: Sunday Brunch Video for 12th January 2020

    Paul McLellan
    Paul McLellan
    https://youtu.be/y62D4tVK-_k Made at CES 2020 (camera Gerard Andrews) Last Thursday: The History of Lithography, Part 1: From Stones to Lasers Last Friday: The History of Lithography, Part 2: From Double-Patterning to EUV Monday: Proti...
    • 12 Jan 2020
  • Breakfast Bytes: The Rosetta Stone and the British Museum

    Paul McLellan
    Paul McLellan
    In the first week of January, I wrote about Lars Liebmann's Rosetta Stone of Lithography in two posts The History of Lithography, Part 1: From Stones to Lasers and The History of Lithography, Part 2: From Double-Patterning to EUV. Today, the...
    • 10 Jan 2020
  • Breakfast Bytes: What's New in Consumer Electronics? CES 2020

    Paul McLellan
    Paul McLellan
    I come to Las Vegas in the first week of January each year to attend what used to be called the Consumer Electronics Show but now is officially just its initials CES. Over 175,000 attendees are expected. The first pleasant surprise was that they had ...
    • 9 Jan 2020
  • Breakfast Bytes: The 40th Anniversary of LAMBDA Magazine

    Paul McLellan
    Paul McLellan
    Forty years ago today, January 8, 1980, the first issue of LAMBDA magazine was published. The Mead & Conway revolution was getting underway. Doug Fairbairn was at Xerox PARC with Lynn Conway. He would go on to be one of the founders of VLSI ...
    • 8 Jan 2020
  • System, PCB, & Package Design : IC Packagers: Four Reasons to Avoid Multi-Layer Flip-Chip Pin Padstacks

    Tyler
    Tyler
    Designing a package substrate, there are things that many of us do that perhaps we should think twice about. One of those being using a multi-layer padstack for the pins of flip-chip dies. I understand the attractiveness of doing this, but if you’ll give me just a few moments, perhaps I can convince you to put ...
    • 7 Jan 2020
  • System, PCB, & Package Design : BoardSurfers: PCB Electronics—Six Tasks to Prepare Board for Manufacturing

    mrigashira
    mrigashira
    You have placed components and routed the board. You are finally ready to send the design to a fabrication house to be manufactured. But wait, you have to perform a few tasks ...
    • 7 Jan 2020
  • Breakfast Bytes: Open Source in 2020

    Paul McLellan
    Paul McLellan
    I recently wrote a couple of posts about open-source EDA tools, OpenROAD: Open-Source EDA from RTL to GDSII and 2nd WOSET Workshop on Open-Source EDA. I have also written about open-source in general, as an approach to development and an ap...
    • 7 Jan 2020
  • Breakfast Bytes: Protium and Palladium 1st=

    Paul McLellan
    Paul McLellan
    We just finished 2019, of course, so it is time for annual "Best of 2019" lists. Over at John Cooley's DeepChip there was a tie at #1...between the Protium X1 platform and the Palladium Z1 platform. I said that the winners were Protium ...
    • 6 Jan 2020
  • Breakfast Bytes: The History of Lithography, Part 2: From Double-Patterning to EUV

    Paul McLellan
    Paul McLellan
    This is a continuation of yesterday's post The History of Lithography, Part 1: From Stones to Lasers. I'm going to drop in a copy of Lars Liebmann's Rosetta Stone of Lithography so you have it in this post, too. If you want more of an expla...
    • 3 Jan 2020
  • Breakfast Bytes: The History of Lithography, Part 1: From Stones to Lasers

    Paul McLellan
    Paul McLellan
    Lithography was originally a way of printing using a flat stone. Lithos (or λίθος) is the Greek for stone. The stone would be coated with wax, then a drawing made in the wax with some sort of stylus. You had to use a ...
    • 2 Jan 2020
  • The India Circuit: 2019: The Year That Was...And Some Surprising News

    Madhavi Rao
    Madhavi Rao
    The biggest happening in 2019 for India was, of course, the general elections. (Though some may argue that it was the ICC Cricket World Cup, which happens every four years!). While uncertainty and instability were prevalent across the world in 2019, ...
    • 31 Dec 2019
  • System, PCB, & Package Design : The Year That Was: PCB Design Blogs in 2019

    Monika
    Monika
    The first series BoardSurfers is about PCB designing. It provides information on concepts, techniques, and processes that are related to Cadence PCB Design solutions with a new post published ...
    • 31 Dec 2019
  • System, PCB, & Package Design : IC Packagers: Stepping into 2020

    mrigashira
    mrigashira
    We started 2019 with the promise to cover all the topics that might interest you as we go, looking at a new area every week. To keep this promise we had a whole lot of exciting tasks. To start with we needed to know what you want to re...
    • 30 Dec 2019
  • System, PCB, & Package Design : IC Packagers: Routing Clean-Up Prior to Manufacturing

    Tyler
    Tyler
    A fantastic year is ending, so I want to take a quick opportunity to go over some of the lesser-known commands available to you for cleaning up and optimizing your routing for manufact...
    • 29 Dec 2019
  • System, PCB, & Package Design : IC Packagers: Guiding Your Team with Workflows

    Tyler
    Tyler
    The flow for efficiently and correctly designing a package substrate layout is a complex task. Many teams define steps to be followed by designers to make sure that rul...
    • 24 Dec 2019
  • Breakfast Bytes: Sunday Brunch Video for 22nd December 2019

    Paul McLellan
    Paul McLellan
    https://youtu.be/iEuzyt_6O_A Made in my living room (camera Carey Guo) Monday: The Most Important Operating System Ever Tuesday: What's Happening in RISC-V Land? Wednesday: System in Package? How to Plan and Build It Thursday: IEDM 2019...
    • 22 Dec 2019
  • PCB、IC封装:设计与仿真分析: 如何利用Allegro SiP Layout工具5步实现复杂引线框架封装的完整设计?

    TeamAllegro
    TeamAllegro
    文章翻译自Cadence博客“Designing a Complex Leadframe Package? See How SiP Layout Tool Can Cover All the Steps”。 space 随着技术的发展,引线框架封装设计变得越来越复杂。新材料和制造工艺的出现,使得封装中可以有更多有源和无源元件,同时新的接合能力扩展了可用引脚数量。 与此同时,信号完整性、电源完整性和温度完整性挑战也随之增加。以前可以在机械CAD工具中完成的简单设计,现在需要...
    • 20 Dec 2019
  • Academic Network: Cadence Co-organized the First EDA Competition to Help China Train More EDA Talent

    Tracy Zhu
    Tracy Zhu
    The first “China IC and EDA Design Elite Competition” started in June 2019 and received high attention and support from many universities. In total, there&nbs...
    • 20 Dec 2019
  • Breakfast Bytes: Off-Topic: 2019 TV Anniversaries

    Paul McLellan
    Paul McLellan
    It's the day before a holiday. Or in this case, ten days when Cadence will be shut down. As is traditional, I write about whatever I feel like, provided it has nothing to do with EDA or semiconductors. Today, some TV programs. This has been a big yea...
    • 20 Dec 2019
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